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High aspect ratio stacked MLCC design

A high aspect ratio, multi-layer ceramic technology, applied in the field of improved external lead design, high integration density electronic components, can solve the problems of easy dumping, increased aspect ratio, etc.

Inactive Publication Date: 2014-08-20
KEMET ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, stacking small elements one after the other increases the aspect ratio, creating a mechanically unstable part that tends to tip over during assembly
The vias or mechanical supports being used in the prior art increase the footprint which contradicts the miniaturization as mentioned above

Method used

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Embodiment Construction

[0040] The present invention is directed to an improved lead structure for stacked electronic components, in particular to stacked MLCCs. More specifically, the present invention is directed to lead structures that include positioning pins that allow for aspect ratios such as Figure 25 The height (H) to shortest width (W) ratio shown is very large while minimizing the possibility of the stacked components shifting or toppling during handling.

[0041] The present invention provides a capacitor stack, most preferably an MLCC capacitor stack, that allows the designer to take advantage of the vertical space on the board to increase the density of capacitors in a given area of ​​the board, thereby enhancing functionality such as capacitance density. This is accomplished by incorporating into the leadframe stabilizing feet designed for surface mount applications, where the stabilizing feet extend into the void and preferably through the substrate or board, while the leadframe pins...

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Abstract

An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.

Description

technical field [0001] The present invention relates to improved capacitors suitable for use in high integration density electronic components (especially capacitors). More specifically, the present invention relates to an improved external lead design that allows high aspect ratios to be formed in electronic components, particularly in stacked multilayer ceramic capacitors (MLCCs). Background technique [0002] In the process of designing modern complex circuits, there are many considerations that go beyond electrical specifications. Component stability during the assembly process is a very important criterion which must be considered in the design. This consideration becomes even more important as efforts continue towards further miniaturization. Increasing lateral integration parallel to the board surface becomes increasingly difficult due to the large number of additional components required. Therefore, the effective utilization of the vertical space perpendicular to ...

Claims

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Application Information

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IPC IPC(8): H01G4/232H01G4/12
CPCH05K2201/09063Y10T29/49139H01G4/232H05K3/303H05K2201/10515H01G4/12H01G4/38H01G4/30Y10T29/49142H05K2201/10772H01G2/06H05K2201/10878H05K2201/10856Y02P70/50
Inventor 约翰·E·麦康奈尔艾伦·P·韦布斯特朗尼·G·琼斯加里·L·伦纳杰弗里·贝尔
Owner KEMET ELECTRONICS CORP
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