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3D (Three Dimensional) COB (Chip On Board) LED (Light Emitting Diode) lamp light-emitting assembly and LED lamp

A 3DCOBLED, LED lamp technology, applied in the field of LED lighting, can solve problems such as power limitation, and achieve the effect of improving heat dissipation efficiency, improving heat dissipation efficiency, and good luminous effect

Active Publication Date: 2014-08-27
SHANGHAI TOPLITE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat dissipation problem of the LED light is not well solved, so its power is greatly limited, and the present invention hopes to provide different technical solutions on this basis

Method used

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  • 3D (Three Dimensional) COB (Chip On Board) LED (Light Emitting Diode) lamp light-emitting assembly and LED lamp
  • 3D (Three Dimensional) COB (Chip On Board) LED (Light Emitting Diode) lamp light-emitting assembly and LED lamp
  • 3D (Three Dimensional) COB (Chip On Board) LED (Light Emitting Diode) lamp light-emitting assembly and LED lamp

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Experimental program
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Embodiment Construction

[0071] Those skilled in the art understand that the present invention mainly provides a 3D COB LED lamp lighting assembly, and the heat dissipation function mainly depends on the heat sink 91 connected to the substrate 2, and the heat sink 91 is either directly in contact with the external environment, or The base of the LED lamp is in contact with the external environment. When the LED light-emitting chipset 3 emits light and generates heat, the heat is quickly transferred to the radiator 91 through the substrate 2 , and then transferred to the external environment through the radiator 91 . Further, those skilled in the art understand that, compared with the prior art, the advantage of the present invention is at least that the heat emitted by the LED light-emitting chipset 3 in the prior art is mainly transmitted to the heat sink through the air, and then through The heat sink is conducted to the external space, and the invention conducts the heat to the heat sink through the...

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Abstract

The invention provides a 3D (Three Dimensional) COB (Chip On Board) LED (Light Emitting Diode) lamp light-emitting assembly which is used for emitting light in an LED lamp. The LED lamp at least comprises an LED bulb casing 1 and a radiator 91. The LED lamp light-emitting assembly at least comprises a base board 2 and an LED light-emitting chipset 3. The LED light-emitting chipset 3 is attached to the base board 2. The base board 2 is connected with the radiator 91 so as to enable the heat of the LED light-emitting chipset 3 to be transferred onto the radiator 91 through the base board 2.

Description

technical field [0001] The present invention relates to the field of LED lighting, in particular to an LED lamp, and in particular to a 3D COB LED lamp. Background technique [0002] With the large-scale application of LED, the advantages of LED as a new light source for emerging lighting are becoming more and more obvious. For example, the Chinese patent application with the patent application number 201310239213.5 and the invention title "LED lamp and its filament" proposes an LED light-emitting component, which uses a glass substrate, and a light-emitting chipset is attached to the glass substrate. Fluorescent substances are coated on the above-mentioned light-emitting chipset, and fluorescent substances are coated on the outside of the glass substrate, which has the advantage of being able to emit light from both sides, but at the same time brings the LED light-emitting component and is placed behind the bulb shell. The above-mentioned problem that the heat emitted by t...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V29/00H01L33/62H01L33/64F21Y101/02F21K9/232F21K9/235F21Y115/10
Inventor 李建胜
Owner SHANGHAI TOPLITE TECH