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A high-power tile-type phased array antenna

A phased array antenna, tile-type technology, applied in the field of communication, can solve the problems of chip heating, inability to apply high-power applications, poor chip heat dissipation effect, etc., and achieve the effect of increasing heat dissipation, increasing heat dissipation effect, and meeting heat dissipation requirements.

Active Publication Date: 2021-11-30
成都华芯天微科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem that the existing tile-type phased array antenna has a poor internal chip heat dissipation effect, which makes it unsuitable for high-power applications, the purpose of the present invention is to provide a real-time solution to the problem of chip heating in the antenna, so as to truly realize Tile Phased Array Antenna for High Power Transmission

Method used

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  • A high-power tile-type phased array antenna
  • A high-power tile-type phased array antenna
  • A high-power tile-type phased array antenna

Examples

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Embodiment 1

[0046] Such as Figure 1-8 As shown, the high-power tile-type phased array antenna provided in this embodiment includes a first printed circuit board layer 1 , a second printed circuit board layer 2 and a third printed circuit board layer 3 arranged in sequence.

[0047] The first printed circuit board layer 1 is used for transmitting radio frequency signals and implementing a 64-unit power division network.

[0048] The second printed circuit board layer 2 is electrically connected to the first printed circuit board layer 1 for phase shifting and attenuation of control signals.

[0049] The third printed circuit board layer 3 is electrically connected to the second printed circuit board layer 2 for power supply and signal input control.

[0050] Several chips 4 for signal output are arranged on the first printed circuit board layer 1 .

[0051]A heat dissipation cold plate 5 is also provided between the second printed circuit board layer 2 and the third printed circuit boar...

Embodiment 2

[0063] Such as Figure 1-8 As shown, this embodiment is a specific implementation of the high-power tile-type phased array antenna described in Embodiment 1.

[0064] The following is a detailed description of the structure of the phased array antenna:

[0065] Such as figure 1 , figure 2 with image 3 As shown, the specific structure of the heat dissipation cold plate is described below:

[0066] Optimally, the heat dissipation cold plate 5 is a hollow plate, wherein a capillary heat dissipation channel 6 is provided in the inner cavity of the heat dissipation cold plate 5 , and a heat dissipation liquid is stored in the capillary heat dissipation channel 6 .

[0067] The surface of the heat dissipation cold plate 5 facing the second printed circuit board layer 2 is provided with a number of heat dissipation bosses 7 equal in number to the chips 4 .

[0068] Each heat dissipation boss 7 is used as a heat absorbing end of the heat dissipation cold plate 5 , and contacts ...

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Abstract

The invention discloses a high-power tile-type phased array antenna, which comprises a first printed circuit board layer, a second printed circuit board layer and a third printed circuit board layer arranged in sequence; the first printed circuit board layer The circuit board layer is used to transmit radio frequency signals and implement a power division network of 64 units; the second printed circuit board layer is electrically connected to the first printed circuit board layer, and is used to control the phase shift and attenuation of the signal; the The third printed circuit board layer is electrically connected to the second printed circuit board layer for power supply and signal input control; the first printed circuit board layer is provided with a number of chips for signal output; A heat dissipation cold plate is also provided between the second printed circuit board layer and the third printed circuit board layer, and the heat absorption end of the heat dissipation cold plate contacts the chip. The invention can solve the problem of chip heating in the antenna in real time, thereby truly realizing high-power transmission of signals.

Description

technical field [0001] The invention relates to the technical field of communications, in particular to a high-power tile-type phased array antenna. Background technique [0002] Traditional radar phased array antennas mainly use brick-type T / R components or tile-type T / R components. The traditional brick-type integration method mainly refers to: T / R components adopt vertical layout and horizontal assembly integration form; The tile-type integration method mainly refers to: T / R components adopt the integration form of horizontal layout, vertical assembly, and vertical interconnection. [0003] The traditional brick-type antenna has a large vertical size, heavy weight, low integration, and high requirements on the scale of the feed network, while the tile-type antenna has a series of high-density integration, low profile, light weight, and low mass production cost. advantages, so that a large number of applications can be obtained. [0004] However, the current tile-type ph...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/00H01Q21/00H01Q23/00
CPCH01Q1/02H01Q21/00H01Q21/0006H01Q23/00
Inventor 汪渊
Owner 成都华芯天微科技有限公司
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