A slicing device

Abstract

The invention discloses a chipping device, which includes a feeding unit, a suction unit and a negative pressure unit. The negative pressure unit includes a negative pressure box, at least one air extraction hole arranged on the negative pressure box, a sealed box body, and Connected air pump and liquid pump, these air holes are respectively connected to the sealed box, the negative pressure adsorption hole is connected to the negative pressure box, the negative pressure box is partly located in the water tank, and at least one of the air holes is located near the top of the water surface in the water tank Location. This design divides the slices in water, and absorbs and transports the slices through negative pressure power, separates the gas and liquid through a sealed box and the air suction pump and liquid suction pump connected to it, and sends the separated water to Return to the water tank to keep the water in the water tank for fragmentation, and ensure the negative pressure space in the sealed box, so as to improve the adsorption force of the negative pressure adsorption holes, and at the same time make maximum use of the negative pressure in the negative pressure box. The negative pressure volume can be pumped, the working efficiency of the negative pressure is improved, the structure is reliable, and it is suitable for popularization and application.

Description

technical field [0001] The invention relates to a silicon chip processing equipment, in particular to a slicing device for slicing underwater. Background technique [0002] Before inserting the silicon wafers, the stacked silicon wafers should be divided into slices. Since the silicon wafers are light and fragile, and there is a certain amount of adsorption between adjacent silicon wafers, the slices are chosen to be divided in water. When slicing, negative pressure adsorption is generally used to achieve slicing and transportation, which will cause part of the water in the tank to be pumped out with the negative pressure, which will cause the water in the tank to decrease continuously, which is not conducive to slicing. In addition, it will also Affect the efficiency of negative pressure adsorption. Contents of the invention [0003] In view of the above-mentioned technical deficiencies, the purpose of the present invention is to provide a slicing device, which can separ...

AI Technical Summary

Problems solved by technology

[0002]Before inserting silicon wafers, the stacked silicon wafers must be sliced ​​first, and because the silicon wafers are light and fragile, and the adjacent silicon wafers There is a certain adsorption force between them, so we choose to divide the pieces in water. When dividing the pieces, negative pressure adsorption is generally used to realize the separation and transportation. This will cause part of the water in the tank to be drawn out with the negative pressure, which will cause the water tank The continuous reduction of water in the film is not conducive to fragmentation. In addition, it will also affect the efficiency of negative pressure adsorption.

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