Adhesive tape cutting method and adhesive tape cutting apparatus
A technology for cutting off devices, adhesive tapes, used in transportation and packaging, metal processing, electrical components, etc.
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[0045] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in this embodiment, an apparatus for affixing an adhesive tape for surface protection to a semiconductor wafer (hereinafter, simply referred to as a “wafer”) will be described as an example.
[0046] figure 1 It is a perspective view showing the overall structure of the adhesive tape sticking device, figure 2is a top view of the adhesive tape sticking device, image 3 It is a perspective view showing the main part of the adhesive tape sticking device.
[0047] Such as figure 1 and figure 2 As shown, the adhesive tape sticking device includes a wafer supply / recovery unit 1, a wafer transport mechanism 2, an alignment table 3, a holding table 4, a tape supply unit 5, a separator recovery unit 6, a sticking unit 7, a first cutting Mechanism 8, peeling unit 9, tape recovery unit 10, second cutting mechanism 11, etc. Here, the wafer supply / recovery unit 1 ...
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