A panel and its manufacturing method
A manufacturing method and panel technology, applied in cable/conductor manufacturing, instrumentation, electrical digital data processing, etc., can solve problems affecting product functions and quality of use, easy to etch conductive patterns, and increase the width of slits, etc., to avoid The effect of repeated etching, solving defects and improving yield
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[0028] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0029] In the following description, many specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways than those described here, so the present invention is not limited by the specific embodiments disclosed below.
[0030] The term "located" in the present invention includes "directly located", that is, direct contact; it also includes "indirectly located", that is, there is a spacer layer in the middle, and there is no direct contact.
[0031] An embodiment of the present invention provides a panel, such as figure 1 As shown, a transparent substrate 10 , a first conductive layer 12 , and a second conductive layer 14 are included. The first conducti...
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