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Packaging substrate, packaging method, display panel

A technology for packaging substrates and packaging methods, which is applied in the manufacture of electrical components, electrical solid devices, semiconductors/solid devices, etc., and can solve problems such as damage to packaging substrates

Active Publication Date: 2016-02-03
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problems to be solved by the present invention include, aiming at the problem that the existing packaging substrate is easy to be damaged during the packaging process, to provide a non-destructive packaging substrate, packaging method, display panel

Method used

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  • Packaging substrate, packaging method, display panel
  • Packaging substrate, packaging method, display panel
  • Packaging substrate, packaging method, display panel

Examples

Experimental program
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Embodiment 1

[0026] Such as figure 2 As shown, the present embodiment provides a packaging substrate 2, which includes a base 21, and the base 21 can be made of glass and other materials.

[0027] Wherein, a pressure-bearing layer 23 is also provided on the side of the substrate 21 used to contact the indenter 9 during packaging, and the projection of the pressure-bearing layer 23 on the substrate 21 coincides with the area of ​​the substrate 21 corresponding to the packaging area Q1 during packaging. .

[0028] That is to say, a pressure bearing layer 23 is provided on the pressure receiving side of the substrate 21 , and during packaging, the shape, size, and position of the pressure bearing layer 23 correspond exactly to the packaging area Q1 . The packaging substrate 2 of this embodiment includes a pressure-bearing layer 23, so only the part of the substrate 21 with the pressure-bearing layer 23 is under pressure during packaging, and the pressure-bearing layer 23 corresponds to the ...

Embodiment 2

[0052] This embodiment provides a display panel, which is packaged by the method of the above embodiment.

[0053] Wherein, the display panel is preferably an organic light emitting diode display panel, more preferably a flexible organic light emitting diode display panel.

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Abstract

The invention provides a packaging substrate, a packaging method, and a display panel, which belong to the field of display technology and can solve the problem that the existing packaging substrate is easily damaged during the packaging process. The packaging substrate of the present invention includes a base, and a pressure-bearing layer arranged on the base to contact the side of the indenter during packaging, and the projection of the pressure-bearing layer on the base is the same as that of the corresponding packaging area of ​​the base during packaging. Regions overlap. The invention can be used for the packaging of organic light emitting diode display panels, especially the packaging of flexible organic light emitting diode display panels.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to a package substrate, a package method and a display panel. Background technique [0002] There are many display structures used for display in the display panel, such as organic light-emitting diodes (OLEDs), liquid crystal layers, etc. In order to prevent these display structures from being damaged during use, they need to be sealed during the production process so that they can be separated from the The external environment is separated, and this process is called "encapsulation"; wherein, the enclosed area is called the encapsulation area, and there is usually an edge area for arranging leads, etc. outside the encapsulation area. [0003] figure 1 A packaging method for an OLED display panel is shown. A barrier layer 22 (BF, Barrierfilm) is adhered to a base 21 (mostly a glass plate) of the packaging substrate 2, and the barrier layer 22 just corresponds to the O...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K71/00H10K77/10H10K59/873
Inventor 石领
Owner BOE TECH GRP CO LTD