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Power module with connecting device configured as a membrane composite

A technology for power components and composites, which can be used in electrical components, electrical solid-state devices, semiconductor devices, etc., and can solve problems such as reducing connection fatigue strength.

Active Publication Date: 2018-04-17
SEMIKRON ELECTRONICS GMBH & CO KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such stresses can subject the adjacent material-bonded connection between the power semiconductor component and the connecting device to high loads and reduce the fatigue strength of the connection

Method used

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  • Power module with connecting device configured as a membrane composite
  • Power module with connecting device configured as a membrane composite
  • Power module with connecting device configured as a membrane composite

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0029] figure 1 and figure 2 A schematic partial section through a power module 1 according to the invention is shown in side section under different thermal conditions. The upper edge 200 of the conductor tracks 20 of the substrate 2 is shown here. Two power semiconductor components 3 are arranged on this conductor track 20 and are electrically conductively connected by means of a connecting device 5 .

[0030] These power semiconductor components 3 are, for example, two diodes connected in parallel, in particular power diodes.

[0031] The connecting device is designed here as a film composite 5 consisting of electrically conductive and electrically insulating films 50 , 52 . The electrically insulating film 52 is here unstructured in the region shown and is thus formed continuously. The electrically conductive film 50 itself is structured, wherein sections of the electrically conductive film 50 , ie film conductor tracks 500 , contact the left power semiconductor comp...

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PUM

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Abstract

The invention relates to a power module with a connection device designed as a film composite, with a substrate having power semiconductor components and a connection device designed as a film composite with an insulating film and a conductive film, It is connected to the contact surface of the power semiconductor component or to the contact surface of the conductor track of the substrate, wherein the film composite has: several basic slits extending at the same distance from each other, wherein two adjacent basic slits do not have a continuous straight extension; and / or a first wide slit, which protrudes from the contact surface beyond the edge of the contact surface; and / or a second wide slit, which breaks off the section of the conductive film which makes contact with the contact surface These are two film conductor tracks that are not directly conductively connected to each other.

Description

technical field [0001] The invention describes a power component, which is used, for example, in a power semiconductor module or as a subcomponent of a power electronics system. Such power components have a substrate with conductor tracks and power semiconductor components arranged thereon. The power semiconductor components are electrically conductively connected to each other or to conductor tracks by means of interconnecting means in an electrical circuit. Background technique [0002] Different configurations of substrates, for example as substrates with a body of ceramic insulating material and conductor tracks arranged thereon, are common in the art. Likewise, different implementations and combinations of power semiconductor devices common in the field, especially power transistors designed as power transistors, are often suitable for connection with power diodes or power thyristors. Furthermore, connecting means are common in the art as wire bonds or film composites...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/485H01L25/07
CPCH01L23/24H01L23/293H01L2224/06181H01L2224/32225H01L2224/33181H01L23/3735H01L23/49833H01L23/4985H01L2924/1301H01L2924/00
Inventor 格雷戈尔·克莱姆斯特凡·施米特乌尔里希·扎格鲍姆
Owner SEMIKRON ELECTRONICS GMBH & CO KG