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Casing Of Electronic Device And Method Of Manufacturing The Same

The technology of an electronic device and manufacturing method is applied in the direction of electrical equipment shells/cabinets/drawers, electrical components, metal shells, etc., which can solve the problems of affecting color appearance, uneven dyeing, mold scratches, etc., achieve uniform color appearance, prevent Effect of uneven dyeing and good mechanical strength

Active Publication Date: 2014-09-24
HTC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the production process, if the metal parts of the electronic device casing are dyed first, and then the metal parts and plastic parts are combined, the metal parts are easily scratched by the mold during the insert molding process or in-mold molding process, which will affect its color. Exterior
If the metal part and the plastic part are combined first, and then the electronic device casing is dyed through the anodizing process, the airtightness between the metal part and the plastic part is insufficient, and it is easy to make the anodic treatment process The process solvent remains between the two, causing uneven dyeing in the subsequent dyeing process

Method used

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  • Casing Of Electronic Device And Method Of Manufacturing The Same
  • Casing Of Electronic Device And Method Of Manufacturing The Same
  • Casing Of Electronic Device And Method Of Manufacturing The Same

Examples

Experimental program
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Embodiment Construction

[0037] Figure 1A is a schematic diagram of an electronic device casing according to an embodiment of the present invention. Figure 1B yes Figure 1A The sectional view of the electronic device casing along the line I-I'. Please refer to Figure 1A and Figure 1B , in this embodiment, the electronic device casing 100 includes a metal shell 110, a first non-conductive partition 120a and a second non-conductive partition 120b, wherein the metal shell 110 has an inner surface S1 and an outer surface S2 opposite to the inner surface S1. The inner surface S1 is recessed inwardly to roughly form a recessed structure, so that other components of the electronic device (not shown) (such as a battery, a circuit board or an audio device) can be disposed in the housing 100 of the electronic device. The electronic device casing 100 can be used to cover other components suitable for the electronic device to form the electronic device. The electronic device is, for example, a smart phone,...

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PUM

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Abstract

A method of manufacturing a casing of an electronic device is provided. The method of manufacturing the casing of the electronic device includes following steps: providing a metal hosuing provided with an inner face and an outer face opposite to the inner face, forming a plurality of holes in the inner face of the metal housing, forming a non-conductive layer, a part of which extends into the holes, on the inner face of the metal housing, and dyeing the outer face of the metal housing to form the casing of the electronic device. The invention further discloses the casing of the electronic device.

Description

technical field [0001] The invention relates to a casing and a manufacturing method thereof, and in particular to an electronic device casing and a manufacturing method thereof. Background technique [0002] In recent years, with the increasing development of the technology industry, electronic devices such as notebook computers (Notebook Computer, NB), tablet computers (Tablet Computer) and smart phones (Smart Phone) and other products have frequently appeared in daily life. The types and functions of electronic devices are becoming more and more diverse. The convenience and practicality make these electronic devices more popular and can be used for different purposes. [0003] In order to maintain the mechanical strength of the housing of the electronic device while pursuing a light and thin design, it is known to combine metal parts and plastic parts to make the housing of the electronic device with different materials. Metal parts and plastic parts can be combined by gl...

Claims

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Application Information

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IPC IPC(8): H05K5/04
CPCH05K5/0217H05K5/04
Inventor 吴仲庭庄政洁吕吉仁朱俊龙林建宏
Owner HTC CORP
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