Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Vacuum evaporation apparatus

An evaporation and vacuum technology, applied in vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve the problem that the evaporation rate of evaporation materials cannot be monitored independently

Inactive Publication Date: 2014-09-24
PANASONIC CORP
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this case, if a film thickness meter is arranged in the cylindrical body to monitor the vapor deposition rate of the vapor deposition material, since the vapor deposition material is attac

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Vacuum evaporation apparatus
  • Vacuum evaporation apparatus
  • Vacuum evaporation apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] For the vacuum evaporation device according to the first embodiment of the present invention, refer to figure 1 Be explained. The vacuum evaporation device 1 of the present embodiment is used to evaporate a plurality of (in this example, two types) evaporation materials on the object to be evaporated 2, and is provided with: a first evaporation source 3 for evaporating one evaporation material 30 ; The second evaporation source 4 makes another evaporation material 40 evaporate. In addition, the vacuum evaporation device 1 also includes: a cylindrical body 5, which surrounds the space between the first and second evaporation sources 3, 4 and the vapor-deposited body 2, and has an opening surface on the vapor-deposited body 2 side; In the chamber 6, the space in which the vapor deposition object 2, the first and second evaporation sources 3 and 4, and the cylindrical body 5 are disposed is in a vacuum state. The vacuum chamber 6 is configured such that its interior can ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A vacuum evaporation apparatus (1) is provided with: first and second evaporation sources (3, 4) that evaporate vapor deposition materials (30, 40); a deposition rate control unit (81) that controls the operation of each of the first and second evaporation sources (3, 4); deposition rate setting storage units (82a, 82b) that store each preset deposition rate setting (A1, A2) of the first and second evaporation sources; and first and second film thickness meters (7a, 7b) that measure mixing deposition rates (Y1, Y2) of the vapor deposition materials. A measuring unit (85) calculates: a delivery ratio (B1) of one vapor deposition material of the second film thickness meter (7b) to the first film thickness meter (7a); a delivery ratio (B2) of the other vapor deposition material of the first film thickness meter (7a) to the second film thickness meter (7b); and each deposition rate (X1, X2) of the first and second evaporation sources from the mixing deposition rates (Y1, Y2). The deposition rate control unit (81) controls the first and second evaporation sources (3, 4) in such a manner that the calculated values match the settings.

Description

technical field [0001] The present invention relates to a vacuum vapor deposition apparatus for forming a thin film by vapor-depositing a vapor deposition material on various vapor deposition objects such as a substrate. Background technique [0002] The vacuum evaporation device arranges an evaporation source containing an evaporation material and an evaporation target such as a substrate in a vacuum chamber, and in a state where the vacuum chamber is depressurized, the evaporation source is heated to vaporize the evaporation source, and the vaporization The final evaporation material is deposited on the surface of the object to be evaporated to form a thin film. However, a part of the vapor deposition material vaporized from the evaporation source may not travel to the vapor deposition object and may not adhere to the surface of the vapor deposition object. If the amount of vapor deposition material that does not adhere to the vapor deposition target increases, it will ca...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C23C14/24
CPCC23C14/243C23C14/542C23C14/24
Inventor 北村一树宫川展幸
Owner PANASONIC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com