LED chip encapsulated without routing and encapsulation technology

Abstract

The invention discloses an LED chip encapsulated without routing. The LED chip encapsulated without routing sequentially comprises a transparent conducting layer, an emitting layer and a liner from the top to the bottom; the LED chip encapsulated without routing further comprises a positive electrode, a negative electrode and an isolation region, wherein the positive electrode extends upwards to the transparent conducting layer along the liner; the isolation region is arranged between the positive electrode and the negative electrode and extends upwards to the transparent conducting layer. The invention further discloses an encapsulation technology. The encapsulation technology comprises the following steps: the negative electrode is arranged on the liner; the positive electrode is arranged on the liner and the positive electrode is enabled to be connected with the transparent conducting layer; an isolation aisle allowing the negative electrode to be isolated from the positive electrode is arranged. The LED chip encapsulated without routing and the encapsulation technology overcome the problem of low qualification rate caused by belt lines; the qualification rate of the product is improved.

Description

technical field [0001] The invention relates to the field of lighting equipment, in particular to a wire-free packaged LED chip and a package process. Background technique [0002] LED chips are the core components of LEDs, etc., and their main function is to convert electrical energy into light energy. At present, the specific structure of traditional LED chips is as follows: figure 1 As shown, it includes a transparent conductive layer 1, a first light-transmitting layer 2, a light-emitting layer 3, a second light-transmitting layer 4, a reflective layer 5, and a substrate 6 from top to bottom. This kind of LED chip is connected to the negative electrode with the substrate, and the positive electrode is connected to the transparent conductive layer by wire bonding. [0003] When making this kind of LED chip, the substrate 6 used is a conductive semiconductor structure. Although the above-mentioned vertical chip is the most direct and reasonable method, it also limits the ...

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Problems solved by technology

[0003] When making this kind of LED chip, the substrate 6 used is a conductive semiconductor structure. Although the above-mentioned vertical chip is the most direct and reasonable method, it also limits the subsequent packaging and packaging costs of the LED chip, which is unavoidable. Yield loss and cost increase due to wire bonding, and problems such as decreased light output due to electrode shadowing cannot be overcome

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