Automatic alignment device for stainless steel substrate loading

An automatic alignment, stainless steel technology, used in laser welding equipment, welding/welding/cutting items, manufacturing tools, etc., to achieve the effect of ensuring positional accuracy

Active Publication Date: 2014-10-08
中科长光精拓智能装备(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide an automatic alignment device for feeding stainless steel substrates, which can effe

Method used

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  • Automatic alignment device for stainless steel substrate loading
  • Automatic alignment device for stainless steel substrate loading
  • Automatic alignment device for stainless steel substrate loading

Examples

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Example Embodiment

[0032] like figure 1As shown, the stainless steel feeding automatic alignment device of the present invention includes a platform base 1, a feeding platform device 2, an initial positioning camera 33, a feeding base 4, a feeding manipulator 5, a fine positioning camera 63, and an adsorption platform 7; The loading platform device 2 is installed on the platform base 1 by a Y-direction linear motion mechanism, and can perform a Y-direction linear motion on the platform base 1; the initial positioning camera 33 is connected by the initial positioning camera base 31 and the initial positioning camera The block 32 is installed on the platform base 1, and the initial positioning camera 33 is located above the feeding platform device 2; the feeding base 4 is fixed on the platform base 1, and the feeding manipulator 5 is installed on the feeding base 9, X-direction and Z-direction linear movement can be performed on the feeding base 9; the fine positioning camera 63 is fixed on the pl...

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Abstract

The invention relates to an automatic alignment device for stainless steel substrate loading. A loading platform device of the device is installed on a platform base through a Y-direction straight-line motion mechanism and can carry out Y-direction straight-line motion on the platform base. A primary positioning camera is installed above the loading platform device. A loading base is fixed to the platform base. A loading mechanical hand is installed on the loading base, and can carry out X-direction and Z-direction straight-line motion on the loading base. A fine positioning camera is fixedly arranged above a suction platform of the platform base and used for adjusting the position of the suction platform to achieve fine positioning of a stainless steel substrate. The suction platform is installed on the platform base through an X-direction straight-line motion mechanism, the Y-direction straight-line motion mechanism and a rotary motion mechanism. The fine positioning camera is located above the suction platform. According to the automatic alignment device for stainless steel substrate loading, automatic alignment for stainless steel substrate loading can be effectively achieved, and the cutting position precision of the stainless steel substrate is ensured.

Description

technical field [0001] The invention relates to an automatic alignment device for feeding stainless steel substrates in the technical field of laser cutting. Background technique [0002] Laser cutting is a fast-growing new technology, and has become one of the key technologies for developing emerging industries and transforming traditional manufacturing industries. Laser cutting has been widely used in modern industry due to its wide cutting range, high cutting speed, narrow slit, good cutting quality, small heat-affected zone, and large processing flexibility. Laser cutting technology has also become the most advanced laser processing technology. One of the mature technologies, with the continuous development of laser processing technology, in addition to the application of laser processing in traditional industries, more and more applications in the field of fine processing, such as military industry, electronic product processing, semiconductor Processing fields, etc., ...

Claims

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Application Information

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IPC IPC(8): B23K26/70B23K26/38
CPCB23K26/702B23K2101/36B23K2103/04
Inventor 张德龙黄波钱雨松
Owner 中科长光精拓智能装备(苏州)有限公司
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