Thermal transfer film and its manufacturing method and hard surface structure and its forming method

Abstract

The invention relates to a high-hardness thermal transfer film, which includes a base material, a hard particle layer and a thermal transfer adhesive layer, wherein the hard particle layer includes a first adhesive layer and a plurality of hard particles. The first adhesive layer in the hard particle layer is located on the substrate, and a plurality of hard particles are directly arranged on the first adhesive layer, each hard particle has a first part and a second part, and the first part is embedded in the first adhesive layer. In the layer, the second part is exposed on the first adhesive layer; the thermal transfer adhesive layer covers the exposed surface of the first adhesive layer and the second part of each hard particle. After the high-hardness thermal transfer film is transferred, the base material and the first adhesive layer are removed after transfer to expose the first part of the plurality of hard particles. The invention also discloses the manufacturing method of the above-mentioned high-hardness thermal transfer film, the hard surface structure including the high-hardness thermal transfer film and its forming method. The present invention endows the thermal transfer film with high hardness and wear resistance or scratch resistance through the use of hard particles, prolonging its service life.

Description

technical field [0001] The present invention relates to thermal transfer printing technology, in particular to a high-hardness thermal transfer film and a manufacturing method thereof, a hard surface structure including the high-hardness thermal transfer film and a forming method thereof. Background technique [0002] Thermal transfer technology refers to printing patterns or texts on functional intermediate carriers such as paper or transfer film using thermal transfer ink, and then using transfer printing equipment to transfer the graphic content on the carrier to different materials. Those on the printed matter. Thermal transfer technology generally uses thermal transfer film as an intermediate carrier. However, it is known that the hardness and wear resistance of thermal transfer film are often unsatisfactory. Therefore, some researchers try to transfer the thermal transfer film to the substrate. Finally, spray a protective layer on the surface of the ink layer; or, som...

AI Technical Summary

Problems solved by technology

Thermal transfer technology generally uses thermal transfer film as an intermediate carrier. However, it is known that the hardness and wear resistance of thermal transfer film are often unsatisfactory. Therefore, some researchers try to transfer the thermal transfer film to the substrate. Finally, spray the protective layer on the surface of the ink layer; or, some researchers use fully cured or semi-cured resin as a high-hardness protective layer and spray it on the ink layer

[0003] However, the practice of spraying the protective layer after transfer not only increases the complexity of the manufacturing process, but also reduces the yield of finished products and increases the cost; Curing, and researchers usually choose a resin with a higher molecular weight, which will greatly reduce the stretchability of the transfer film, thus increasing the difficulty of transferring the three-dimensional curved surface

In addition, the hardness and wear resistance are related to the thickness of the protective layer, but using a thicker protective layer to increase the hardness or wear resistance will not only increase the cost, but also adversely affect the appearance of the transfer film

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