A self-emulsifying modified silicone resin emulsion and its preparation method and application

A resin emulsion and silicone technology, applied in the direction of resistor shell/packaging shell/potting, etc., can solve the problems of low strength and high baking temperature of silicone resin, and achieve the goal of reducing curing temperature, overcoming low strength and reducing emissions. Effect

Active Publication Date: 2016-05-04
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, most of the commonly used silicone encapsulants are solvent-based encapsulants, mainly based on benzene or alcohol solvents, and the silicone resin has low strength, high baking temperature, and needs to be made into two components when curing at low temperature. shortcoming

Method used

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  • A self-emulsifying modified silicone resin emulsion and its preparation method and application
  • A self-emulsifying modified silicone resin emulsion and its preparation method and application
  • A self-emulsifying modified silicone resin emulsion and its preparation method and application

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Embodiment 1

[0026] A method for preparing a self-emulsifying modified silicone resin emulsion of the present embodiment comprises the following steps:

[0027] (1) Add 11.73 parts by mass of polyester polyols containing sulfonic acid groups / carboxyl groups with a number average molecular weight of 733 to a reactor with a stirrer and a condensing reflux device. 2h, lower the temperature to 65°C, and control the stirring speed at 150rpm, add 7.54 parts by mass of 3-isocyanatopropyltrimethoxysilane (KH-901) into the reactor, raise the temperature to 75-80°C for 10 minutes, and then immediately Cool down to 60°C, add 8.9 parts by mass of methyltrimethoxysilane, 51.1 parts by mass of dimethyldimethoxysilane and 20 parts by mass of ethyl silicate, and continuously add 24.23 parts by mass of deionized water, the time for dropping for 0.5h, then raise the temperature to 90°C within 0.25h, keep it warm for 1h and then distill until no distillate is distilled out, then discharge the material after ...

Embodiment 2

[0032] A method for preparing a self-emulsifying modified silicone resin emulsion of the present embodiment comprises the following steps:

[0033] (1) Add 12.46 parts by mass of polyester polyols containing sulfonic acid groups / carboxyl groups with a number average molecular weight of 750 to a reactor with a stirrer and a condensing reflux device, and vacuumize and remove water for 2 hours at 130° C. Cool down to 70°C and control the stirring speed at 160rpm, add 8.27 parts by mass of 3-isocyanatopropyltrimethoxysilane (KH-901) into the reactor, raise the temperature to 80°C for 20 minutes and immediately cool down to 60°C, Add 23.14 parts by mass of methyltrimethoxysilane, 38.86 parts by mass of dimethyldimethoxysilane and 20 parts by mass of ethyl silicate, and continuously add 24.70 parts by mass of deionized water for 0.5 hours, and then Raise the temperature to 100°C within 0.3h, keep it warm for 1.5h, distill until no distillate is distilled, and discharge the material ...

Embodiment 3

[0038] A method for preparing a self-emulsifying modified silicone resin emulsion of the present embodiment comprises the following steps:

[0039] (1) Add 11.73 parts by mass of polyester polyols containing sulfonic acid groups / carboxyl groups with a number average molecular weight of 771 to a reactor with a stirrer and a condensing reflux device, and vacuumize and remove water for 2 hours at 130° C. Lower the temperature to 70°C and control the stirring speed to 170rpm, add 8.27 parts by mass of 3-isocyanatopropyltriethoxysilane (KH-907) into the reactor, raise the temperature to 80°C for 20 minutes and immediately cool down to 60°C , add 11.4 parts by mass of methyltriethoxysilane, 48.6 parts by mass of dimethyldiethoxysilane and 20 parts by mass of ethyl silicate, and continuously add 24.23 parts by mass of deionized water for 0.5h , then raise the temperature to 100°C within 0.25h, keep it warm for 1h, and then distill until no fraction is distilled out, and then discharg...

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Abstract

The invention belongs to the technical field of electronic packaging materials and discloses a self-emulsification modified organosilicone resin emulsion and a preparation method and application of the self-emulsification modified organosilicone resin emulsion. The preparation method of the self-emulsification modified organosilicone resin emulsion comprises the following steps: first reacting sulfo group / hydroxyl-containing polyester polyol with an isocyanate-containing silane coupling agent; then, adding a siloxane monomer to react to obtain self-emulsification modified organosilicone resin; then, adding water to emulsify the self-emulsification modified organosilicone resin and adding a neutralizer for neutralization to obtain the self-emulsification modified organosilicone resin emulsion. The self-emulsification modified organosilicone resin emulsion provided by the invention has a good self-emulsifying performance, good mechanical performances and a good curing performance and can be used for packaging ceramic resistors.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging materials, and in particular relates to a self-emulsifying modified silicone resin emulsion and a preparation method and application thereof. Background technique [0002] Packaging materials refer to a type of electronic adhesive that can seal, encapsulate or fill resistors and capacitors in the electronics industry, and can play the role of waterproof, moisture-proof, and heat dissipation. [0003] Silicone resin has a skeleton with alternating silicon-oxygen-silicon bonds, and at high temperature, the organic groups on silicon atoms decompose, and new silicon-oxygen-silicon bonds or silicon-oxygen-carbon bonds can be formed between molecules, so it has excellent thermo-oxidative stability , At the same time, it has good electrical insulation performance, moisture resistance, waterproof, weather resistance and other properties. Due to the above characteristics, silicone resin is oft...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J3/03C08L83/10C08L75/06C08G77/445C08G18/71C08G18/46H01C1/02
Inventor 涂伟萍陈任王锋
Owner SOUTH CHINA UNIV OF TECH
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