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A laser processing technology and processing device based on electrostatic field assistance

A technology of laser processing and processing technology, which is applied in the direction of laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of different processing results, achieve the effects of reducing transmission and accumulation, improving quality, and reducing the scope

Inactive Publication Date: 2016-01-20
XI AN JIAOTONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the influence of time and space on energy distribution, the processing results will also be different

Method used

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  • A laser processing technology and processing device based on electrostatic field assistance
  • A laser processing technology and processing device based on electrostatic field assistance
  • A laser processing technology and processing device based on electrostatic field assistance

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Embodiment Construction

[0031] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0032] Such as figure 1 As shown, the present invention provides a laser processing device based on electrostatic field assistance, including: a laser 1, an integrated laser head 2, and a motion platform 3 for placing samples, wherein the output port of the laser 1 is connected to the integrated laser head 2 The entrance of the integrated laser head 2 is set coaxially, and the light exit of the integrated laser head 2 is located at the upper end of the motion platform 3;

[0033] Such as figure 2 As shown, the integrated laser head 2 includes: a cylindrical rear end body 2-1, and a conical front end body 2-2 installed on the front end of the cylindrical rear end body 2-1. The specific structure of the integrated laser head 2 is:

[0034] 1. Focusing requirements: In order to improve the focusing quality of the laser beam, the collimation and focusing system is int...

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Abstract

The invention discloses an electrostatic field assistance-based laser processing technology and processing equipment thereof. The processing equipment comprises a laser device, an integrated laser head and a motion platform used for bearing a sample, wherein the laser outlet of the integrated laser head is positioned on the upper end of the motion platform; the integrated laser head comprises a cylindrical backend body and a cylindrical frontend body arranged at the front end of the cylindrical backend body; the cylindrical backend body and the cylindrical frontend body are in insulating connection; a laser beam alignment and focusing system for focusing laser beams is arranged in the cylindrical backend body; a gas inlet for introducing auxiliary gas into the cylindrical backend body is formed in the side wall of the cylindrical backend body; the cylindrical frontend body is connected with the negative electrode of a direct-current main, the positive electrode of the direct-current main is connected with the sample, thus an assistant highfield is formed, the binding force borne by atoms on the surface of the sample is reduced, layered stripping of a material can be easily performed by the laser, the stripped product is taken away by the auxiliary air quickly, and the heat accumulation in the material is effectively avoided.

Description

technical field [0001] The invention relates to the field of a laser precision machining method for a micro-nano structure, in particular to an electrostatic field-assisted laser machining process and a machining device thereof. Background technique [0002] Laser technology is a high-tech science that appeared in the 1960s and developed extremely rapidly. Its development and penetration not only affects all aspects of human life, but also drives the development of other disciplines and technologies. Laser technology has become one of the main pillars of high-tech industries in this century. [0003] Due to the characteristics of high brightness, high monochromaticity, high directivity and high coherence, the laser can be focused within the spot range of tens of microns in diameter, and the power density after focusing can exceed 1020W / cm2, such a high energy Acting on the surface or inside of the material in a very short time, the target material in the irradiation range w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/70
CPCB23K26/14B23K26/36
Inventor 王恪典段文强梅雪松王文君凡正杰袁新
Owner XI AN JIAOTONG UNIV
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