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Integrated circuit module with waveguide conversion element

An integrated circuit and waveguide conversion technology, which is applied to waveguide devices, waveguides, circuits, etc., can solve the problems of difficult and complicated preparation

Active Publication Date: 2017-05-10
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Use of vertical elements like these probes may create fabrication difficulties
Fabrication of vertical pins, probes, or antennas is more complex than that of planar structures and is often only possible with lower metal resolution (e.g. larger metal pitch and diameter) to make

Method used

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  • Integrated circuit module with waveguide conversion element
  • Integrated circuit module with waveguide conversion element
  • Integrated circuit module with waveguide conversion element

Examples

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Embodiment Construction

[0020] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustrations specific embodiments in which the invention may be practiced. In this regard, directional terms (such as "top", "bottom", "front", "rear", "front", " end", etc.). Because components of an embodiment may be positioned in a number of different orientations, directional terms are used for purposes of illustration and are in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. Accordingly, the following detailed description should not be viewed in a limiting sense, and the scope of the invention is defined by the appended claims.

[0021] It should be understood that the features of the various exemplary embodiments described herein may be combined with each other unless specifically st...

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PUM

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Abstract

An integrated circuit module having a waveguide conversion element is disclosed. The integrated circuit module includes: a package molding compound layer; a radio frequency (RF) integrated circuit embedded within the package molding compound layer and having RF ports; a waveguide conversion structure embedded within the package molding compound layer; and a redistribution layer. The waveguide conversion structure includes a transmission line interface portion, a waveguide interface portion configured for coupling to a rectangular waveguide housing, and a transducer portion configured to provide mode conversion between the transmission line interface portion and the waveguide interface portion. The redistribution layer includes at least one insulating layer and at least one metallization layer extending between the RF integrated circuit and the waveguide conversion structure across the surface of the package mold compound layer. The first redistribution layer includes an RF transmission line that is conductively connected between the RF port of the RF integrated circuit and the transmission line interface portion of the waveguide switching structure.

Description

technical field [0001] The present application relates to integrated circuit modules, and in particular to radio frequency integrated circuit modules. Background technique [0002] As the complexity of integrated circuits continues to grow, improved packaging techniques have been developed to keep pace with increasing circuit densities and increasing numbers of interconnections. For example, one of these technologies known as embedded wafer-level ball grid array (eWLB) has been developed to support the fan-out of densely spaced integrated circuit terminals to the solder ball interconnects of ball grid array (BGA) packages. [0003] In the case of eWLB packaging, the wafer being processed is diced, and the diced chips are spaced apart on a carrier. The spaces between the chips are filled with a molding compound which is then cured to form the artificial wafer. Thin film technologies are used to form one or more redistribution layers that connect the pads of the integrated c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/053H01L23/12
CPCH01L2224/13H01L2224/221H01L2224/21H01L23/3128H01L21/568H01L23/66H01L24/19H01L24/25H01L2223/6633H01L2223/6677H01L2224/12105H01L2224/24195H01L2224/2518H01L2924/1421H01L2924/15311H01P3/121H01P5/107H01L2924/1461H01L2924/181H01L2924/00H01L21/56H01P1/16H01P5/08
Inventor W.哈特纳E.泽勒M.沃杰诺夫斯基
Owner INFINEON TECH AG