Device for forming circuit on touch panel and circuit forming method

Abstract

A device for forming a circuit on a touch panel and a circuit forming method are disclosed for printing a circuit on the surface of a substrate with flexibility. The device is provided with a plane mold that can be heated to a working temperature. The plane mold is provided with a compression face on which the substrate is to be put. A roller hot compression apparatus is disposed above the plane mold, and can raise the temperature of a roller to the working temperature. The roller is rotatable and forms a rolling face on the circumference of the roller. The plane mold can be subjected to displacement by a sliding manner, and moves from a first position to a second position through the lower part of the roller. The substrate is compressed onto the compression face of the plane mold through compression by the roller and the rolling face during a moving process of the plane mold so as to subject surfaces at two sides of the substrate to hot compression to form the circuit. The device for forming the circuit can increase the yield of the circuit and reduce the storage cost.

Description

technical field [0001] The present invention relates to a device and a circuit forming method for forming a circuit on a touch panel, especially a device and a method for forming a circuit by using a single roller and a flat mold for hot pressing. Background technique [0002] Technologies commonly used to form circuits on touch panels such as Figure 6 As shown, it is that a preheated panel material 6 is wound around double rollers 70, 71 in an S shape, so as to print circuits on both sides of the panel material 6; wherein the distance between the two rollers 70, 71 is calculated and set. The embossing pressure on the panel material 6 can be used to emboss the panel material 6 without damaging it with proper strength. [0003] However, the thickness of the panel material 6 is not the same, which easily leads to different imprinting forces of the double rollers 70 and 71 , thereby affecting the yield rate of circuit formation. On the other hand, with this known technology f...

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Problems solved by technology

[0003] However, the thickness of the panel material 6 is not the same, it is easy to cause the force of the double rollers 70, 71 to imprint it to be different, and then affect the yield rate of circuit formation.

On the other hand, with this known technology for printing circuits, the entire bundle of panel materials 6 must be preheated first, and all the raw materials must be processed in a single process, making it impossible to produce a corresponding number of products in response to an order. If the shipment volume is less than the product output volume, additional storage costs will be incurred

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