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Plating film manufacturing method

A manufacturing method and coating technology, applied in the direction of electrical components, current conduction devices, electric solid devices, etc., can solve problems such as productivity decline, yield decline, and workpiece damage

Active Publication Date: 2014-11-19
SHINKO ELECTRIC IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, at this time, since the cover tape is attached, the cover tape needs to be peeled off after the plating treatment, so there is a problem that the productivity is lowered.
In addition, when the thickness of the workpiece is thin, such as a lead frame, the workpiece is damaged when the cover tape is peeled off, and there are also problems such as a decrease in yield.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0060] In the present example, a plated film was produced on the surface of the workpiece in the following procedure.

[0061] like figure 1 As shown, by connecting a polarity inversion power supply 15 between the workpiece 12 and the electrode 13 and connecting a DC power supply 16 between the workpiece 12 and the electrode 14, the coating film was produced.

[0062] At this time, as the workpiece 12, a metal plate composed of a copper alloy (C194) was used. In addition, as the composition of the plating solution, copper sulfate containing 200g / L, sulfuric acid of 100g / L, chlorine gas of 50ppm, brightener of 2ml / L (manufactured by Rohm&Hass Co., trade name: MICROFILL TM EVF BRIGHTER), 10 ml / L leveler (manufactured by Rohm & Hass Co., trade name: MICROFILL TM EVF LEVELER), and 20 ml / L polymer (manufactured by Rohm & Hass Co., trade name: MICROFILL TM EVF C2) plating solution.

[0063] After producing the coating film under the above-mentioned conditions, it can be confi...

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Abstract

The invention provides a plating film manufacturing method for forming a plating film on a workpiece. The workpiece comprises a main face and the other main face which is on the side opposite to the main face. A polarity reversing power supply is connected between the workpiece and an electrode arranged opposite to one main face of the workpiece. A direct-current power supply is connected between the workpiece and an electrode arranged opposite to the other main face of the workpiece. The plating processes of the one main face and the other main face of the workpiece are performed simultaneously.

Description

technical field [0001] The invention relates to a coating manufacturing method. Background technique [0002] For example, like the joint between a lead frame and a sealing resin, the joint between a metal part and a resin part may peel off due to heating or the like during manufacture or use, and changes over time may cause both Separation occurs between. [0003] For this reason, some methods for improving the bonding strength between metal parts and resin parts have been proposed in the prior art. For example, a method of treating the surface of a metal member to a rough surface (also referred to as a "rough surface") has been proposed. [0004] As a method of forming a roughened surface on a metal surface, for example, Patent Document 1 discloses a roughened rolled copper sheet, which is obtained by placing the rolled copper sheet in an electrolyte solution containing a gloss solution, and using Asymmetric positive and negative pulses under predetermined conditions ar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/18C25D7/06
CPCH01L2224/48091H01L2224/48247H01L2924/00014C25D5/18C25D17/007C25D5/611C25D5/605C25D5/627C25D7/00H01L23/49582
Inventor 吴宗昭有贺庸介
Owner SHINKO ELECTRIC IND CO LTD
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