Fluorescent powder encapsulation structure used for light-mixed LED
A packaging structure and phosphor powder technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of LED device light decay, color drift, phosphor powder attenuation, etc., to avoid direct contact and solve the effect of reducing the conversion efficiency of phosphor powder
Inactive Publication Date: 2014-11-19
NANTONG YAPU LIGHTING ELECTRICAL APPLIANCE MFG
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Problems solved by technology
[0002] The existing mixed-light LED preparation method is to coat the phosphor powder on the surface of the excitable phosphor chip or wrap the chip in fluorescent glue, use the chip to excite the phosphor powder, and make the phosphor powder emit light and mix with the light emitted by the chip body to prepare a mixed light LED. For LED devices, when the chip passes current, the PN junction will generate high temperature due to the electro-optical conversion relationship. Since the phosphor powder is directly coated or wrapped on the chip, the phosphor powder will directly contact the chip, causing the temperature generated by the chip to be directly transmitted to the phosphor powder. , the thermal effect of high temperature leads to the attenuation of the phosphor powder, which leads to the light decay and color drift of the LED device
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[0016] Such as figure 1 As shown, a fluorescent powder packaging structure for a light-mixing LED includes an LED chip and a metal substrate 1, the LED chip is arranged on the upper surface of the metal substrate 1, an insulating layer 2 is laid on the metal substrate 1, and an insulating layer 2 is laid on the insulating layer 2. A circuit layer 3 is arranged above the circuit layer, and an encapsulation adhesive limit layer 4 made of insulating material is laid above the circuit layer to measure the usage of the encapsulation adhesive and protect the chip with the encapsulation adhesive. 4 is further provided with a fluorescent glue limiting layer 5 made of insulating material to measure the amount of fluorescent glue used; the packaging glue limiting layer 4 is filled with packaging glue, and the fluorescent glue limiting layer 4 Pour in fluorescent glue, wherein the encapsulation glue is made of silica gel, and the fluorescent glue is fluorescent powder plus glue.
[0017...
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The invention discloses a fluorescent powder encapsulation structure used for a light-mixed LED. The structure comprises an LED chip and a metal substrate. The LED chip is disposed on an upper surface of the metal substrate. An insulating layer is disposed on the metal substrate. A circuit layer is disposed on the insulating layer. An encapsulation adhesive limiting layer made of an insulating material is disposed on the circuit layer. A fluorescent adhesive limiting layer made of the insulating material is disposed on the encapsulation adhesive limiting layer. The encapsulation adhesive is filled into the encapsulation adhesive limiting layer, the fluorescent adhesive limiting layer is filled with fluorescent adhesive. Beneficial effect of the structure is that problems of color drifting and brightness decay of the LED device caused by reduction of fluorescent powder conversion efficiency are solved.
Description
technical field [0001] The invention relates to the field of optoelectronic technology, in particular to a fluorescent powder packaging structure for mixed-light LEDs. Background technique [0002] The existing mixed-light LED preparation method is to coat the phosphor powder on the surface of the excitable phosphor chip or wrap the chip in fluorescent glue, use the chip to excite the phosphor powder, and make the phosphor powder emit light and mix with the light emitted by the chip body to prepare a mixed light LED. For LED devices, when the chip passes current, the PN junction will generate high temperature due to the electro-optical conversion relationship. Since the phosphor powder is directly coated or wrapped on the chip, the phosphor powder will directly contact the chip, causing the temperature generated by the chip to be directly transmitted to the phosphor powder. , The thermal effect of high temperature leads to the attenuation of the phosphor powder, which leads...
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IPC IPC(8): H01L33/54H01L33/50
CPCH01L33/507H01L33/54
Inventor 彭伟
Owner NANTONG YAPU LIGHTING ELECTRICAL APPLIANCE MFG