Soft board photosensitive film attaching method

A technology of photosensitive film and attachment, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., can solve the problems of low overall efficiency and long time of flexible circuit board manufacturing process, shorten the production time and improve the attachment efficiency , the effect of improving production efficiency

Inactive Publication Date: 2014-11-26
东莞市五株电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the above-mentioned flexible circuit board manufacturing process needs to attach the photosensitive film to the surfaces of multiple flexible substrates separately, the photosensitive film attaching process takes a long time, which leads to the overall efficiency of the above-mentioned flexible circuit board manufacturing process. lower

Method used

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  • Soft board photosensitive film attaching method
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Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0020] In order to improve the production efficiency of the flexible board, the invention provides a sheet-to-roll flexible board photosensitive film attachment method. Please also refer to figure 1 and figure 2 ,in figure 1 It is a schematic flow chart of an embodiment of the flexible board photosensitive film attachment method provided by the present invention, figure 2 yes figure 1 The schematic diagram of the principle of the method for attaching the photosensitive film to the flexible board is shown. The ...

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Abstract

The invention provides a soft board photosensitive film attaching method. The soft board photosensitive film attaching method comprises the steps that a plurality of soft substrates are provided; the soft substrates are conveyed to a film pressing windlass device one by one; photosensitive films are attached to the surfaces of the soft substrates through the film pressing windlass device, and the soft substrates are connected into a whole through the photosensitive films; the soft substrates connected together through the photosensitive films are rolled to form a rolled substrate. By means of the soft board photosensitive film attaching method, the photosensitive film attaching efficiency of a soft circuit board can be improved.

Description

technical field [0001] The present invention relates to a flexible printed circuit (FPC) manufacturing technology, in particular to a method for attaching a photosensitive film to a flexible printed circuit (hereinafter referred to as a flexible printed circuit). Background technique [0002] Flexible circuit boards are widely used in electronic products because of their advantages such as bendability, high wiring density, light weight, thin thickness, less wiring space restrictions, and high flexibility. connection and signal transmission etc. Generally speaking, the flexible circuit board is electrically connected to other circuits through the metal lines on the surface of the flexible mother substrate or the inner layer, and the above metal lines are generally patterned on the copper foil on the surface of the flexible mother substrate. processed. [0003] The existing flexible circuit board manufacturing process first attaches copper foil to the surface of the flexible...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 林洪军
Owner 东莞市五株电子科技有限公司
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