Multi-chip eutectic-bonding pressure dividing device

A distribution device and eutectic welding technology, applied in welding equipment, non-electric welding equipment, electrical components, etc., can solve problems such as undervoltage welding of chips, easily crushed chips, overvoltage and crushed chips, etc., to achieve reasonable distribution and avoid The effect of damaging the chip and avoiding waste

Inactive Publication Date: 2014-12-03
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in fact, the larger the area of ​​the chip, the greater the eutectic welding pressure is required. The pogo pin top pressure method often causes overpressure damage to chips with large

Method used

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  • Multi-chip eutectic-bonding pressure dividing device

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Embodiment Construction

[0017] Such as figure 1 As shown, a multi-chip eutectic welding pressure distribution device provided by the present invention includes a pressure plate 1, and the pressure plate 1 is provided with a positioning hole 2 that matches the positioning column 14 of the graphite fixture 13. The pressure plate 1 The board surface is also provided with a screw hole array 3 penetrating the board body, and a group of bolts 4 cooperating with its thread are arranged in the screw hole array 3, and a pressure head 5 for pressing the chip is arranged at the bottom of the bolt 4; figure 2 As shown, the bottom of the bolt 4 is provided with an insertion hole 6; image 3 , Figure 4 and Figure 5 As shown, the top of the indenter 5 is provided with a plug 7 that matches the socket hole 6. In order to adapt to chips of different areas, the bottom of the indenter can be a first conical indenter 5a, and a second column-shaped bottom. Indenter 5b, or the third indenter 5c whose bottom is irreg...

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Abstract

The invention discloses a multi-chip eutectic-bonding pressure dividing device. The multi-chip eutectic-bonding pressure dividing device comprises a pressure plate (1), the pressure plate (1) is provided with positioning holes (2) matched with positioning columns (14) of a graphite clamp (13), a screw hole array (3) running through the pressure plate is arranged on the top side of the pressure plate, bolts (4) are arranged in the screw array (3) in a threaded match, and the bottoms of the bolts are provided with pressure heads (5) used for pressing chips; the bottoms of the bolts are provided with socket holes (6), the tops of the pressure heads (5) are provided with plugs (7) matched with the socket holes (6), and the pressure heads are socketed with the bolts; the pressure heads are made of flexible materials, and the bottoms of the pressure heads are conical, stand-shaped or specially-shaped; requirements of the chips different in thickness can be met by adjusting height of the bolts, the pressure heads matched with the chips in areas can be replaced according to positions and areas of the chips, reasonable division of pressure is realized, and damage to the chips can be avoided by the aid of the flexible pressure heads; according to the number and the positions of the chips, the number and the positions of the bolts and the pressure heads can be changed, different circuit welding pressures are obtained, and the multi-chip eutectic-bonding pressure dividing device is reusable, and waste is thereby avoided.

Description

technical field [0001] The invention relates to the field of electronic product manufacturing, in particular to a multi-chip eutectic welding pressure distribution device. Background technique [0002] Multi-chip, usually refers to two or more semiconductor bare chips of different models or different sizes or thicknesses. In order to achieve heat dissipation or control the internal atmosphere of the circuit, eutectic welding technology is often used for multi-chip hybrid circuits. Through the eutectic melting of the metal between the chip, the substrate and the middle solder piece, the eutectic welding of the conventional chip is achieved, and the size of the eutectic welding on a thick film substrate is Difficulties are semiconductor bare chips with different heights and a large number. At present, chip eutectic welding is mainly divided into two methods: rubbing eutectic welding and pressurized eutectic welding. Welding, cooling, exhaust and other processes, set the corr...

Claims

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Application Information

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IPC IPC(8): B23K20/26H01L21/603
CPCB23K20/26H01L24/75H01L2224/753
Inventor 李波李文才李寿胜夏俊生李建和
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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