Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electronic component unit and method of manufacturing the same

A technology of electronic components and manufacturing methods, applied in the field of electronic component units and their manufacturing, can solve the problems of increased viscosity of liquid resin raw materials, increased manufacturing costs, insufficient filling, etc., and achieve the effect of excellent waterproof characteristics

Active Publication Date: 2017-06-09
DENSO CORP
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In any case, foamed resins produced using microballoons may increase manufacturing costs compared to foamed resins produced without using microballoons using blowing agents such as physical blowing agents, chemical blowing agents, etc.
In addition, in the foamed resin produced using microballoons, the viscosity of the liquid resin raw material may increase, and mixing of the raw material or filling of gaps between elements to be sealed may be insufficient

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic component unit and method of manufacturing the same
  • Electronic component unit and method of manufacturing the same
  • Electronic component unit and method of manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0046] As follows, the electronic component unit and its manufacturing method will be described with reference to the drawings. Such as figure 1 As described, the electronic component unit 1 in this embodiment includes the electronic component 2 and the resin seal 3 coating the electronic component 2 . The resin seal 3 is made of foamed polyurethane resin. The electronic component unit 1 in this embodiment is an electronic control unit (ECU) for vehicles and has a printed wiring board 20 as the electronic component 2 . Electronic circuitry (not shown) is provided on the printed wiring board. The printed wiring board 20 (printed substrate 20) is a 60 mm long, 67 mm wide, and 1.6 mm thick board, and is made of a general glass epoxy substrate. On both sides of the printed wiring board 20 , various types of semiconductor elements 21 , 22 , 23 and connectors 24 corresponding to external connection terminals of the printed wiring board 20 are mounted. The semiconductor elements ...

no. 2 example

[0076] In this example, an electronic component unit was manufactured similarly to the first example except that the heating temperature of the first raw material liquid by the high-frequency induction heating coil was changed to 100°C. When the heating temperature was set to 100° C., the viscosity of the first raw material liquid was 71 mPa·s. In this example, similarly to the first example, evaluation of resin filling was performed. Furthermore, in this embodiment, similarly to the case of the first embodiment, a test piece made of a foamed resin molded body was produced under the same conditions as the resin seal, and the long-diameter dimension of the connecting hole, Durometer hardness, water penetration distance and breaking strength. In addition, the water penetration distance from the exposed portion of the electronic component unit was measured. The results are shown in Figure 21A to Figure 21C middle.

[0077] (third to sixth embodiments)

[0078] In the third ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
viscosityaaaaaaaaaa
viscosityaaaaaaaaaa
viscosityaaaaaaaaaa
Login to View More

Abstract

The present invention provides an electronic component unit (1) comprising an electronic component (2) and a resin seal (3) coating the electronic component (2). The resin seal (3) is made of foamed resin produced by foaming thermosetting resin. For the distribution of the long-diameter size of the connecting holes (301, 302, 303, 304) connected between the foaming holes of the foamed resin, the average value of the long-diameter size αμm and the standard deviation o'μm satisfy α+3o'≤ 500 relationship. Furthermore, a manufacturing method of the electronic component unit (1) is provided. The manufacturing method includes raw material liquid preparation process, mixing process and coating foam process.

Description

technical field [0001] The present disclosure relates to an electronic component unit provided by coating an electronic component with a resin seal made of a foam of a thermosetting resin and a method of manufacturing the same. Background technique [0002] Recently, electronic components are also used in various technical fields of mobile terminals, vehicles, etc. in addition to various types of electronic devices. Since electronic components are required to have waterproof properties, for example, an electronic component unit in which a whole printed wiring board including electronic components is completed by resin sealing has been developed. For vehicles and mobile terminals, there is also a need to reduce the weight of electronic components. A foamed resin produced by foaming a thermosetting resin such as urethane or the like is used as the resin seal for resin sealing. [0003] At least two types of raw material liquids are mixed, the raw materials are polymerized to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B32B33/00C08G18/76C08G18/40C08J9/08B29C44/12C08G101/00
Inventor 爱知后将吉田明和荒尾修
Owner DENSO CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com