Manufacturing and processing method for direct-bonding TFT LCM

A liquid crystal display module and processing method technology, applied in chemical instruments and methods, layered products, lamination devices, etc., can solve the problems of many bubbles, affect the display effect, and fully fit the gap, so as to achieve product adhesion of bubbles. The effect of less, simple processing flow and high alignment accuracy
CN104181712AInactive Publication Date: 2014-12-03JIANGXI HOLITECH TECH
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Patent Information

Authority / Receiving Office
CN ยท China
Current Assignee / Owner
JIANGXI HOLITECH TECH
Publication Date
2014-12-03
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The invention provides a manufacturing and processing method for a direct-bonding TFT LCM (Liquid Crystal Module), and belongs to the technical field of direct-bonding module processing. The realization process of the manufacturing and processing method is as follows: not assembling backlight on TFT LCM in a direct-bonding module, and gluing OCA on the surface of an up polarizer of FOG in the TFT LCM; after pre-baking and pressurizing for defoaming, using a jig to carry out aligned pre-gluing processing on CTP and FOG; adopting a gluing machine for pressing operation; reusing the jig to assemble backlight after warming and pressurizing for defoaming through a defoaming furnace. The manufacturing and processing method has the advantages that direct-bonding products processed by adopting the method has the advantages of being simple in processing process, high in alignment precision, less in foams in product gluing, high in yield and the like.
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Description

technical field

[0001] The invention belongs to the processing technology of fully laminating modules, and in particular relates to a production and processing method of fully laminating TFT liquid crystal display modules. Background technique

[0002] With the improvement of living standards, one of the development trends of color display modules is to develop towards the direction of full-fit TFT liquid crystal display modules. For ordinary suppliers, because CTP and TFT LCD modules are not produced by the same supplier, generally FOG is first assembled with backlight to form a TFT LCD module, and then assembled with CTP after bonding OCA glue. This production and processing method has an assembly tolerance between TFT FOG and backlight, and a full lamination tolerance between TFT LCD module and CTP, and it is easy to form a full lamination gap, resulting in poor defoaming, which eventually leads to the assembly of TFT FOG and CTP products. If there is a large deviation b...

Claims

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