Fingerprint identification sensor packaging structure and method

A fingerprint identification and packaging structure technology, which is applied in character and pattern recognition, instruments, electric solid devices, etc., can solve the problem of low recognition accuracy of capacitive fingerprint recognition sensors and ineffective capacitive sensing effects of capacitive fingerprint recognition sensors, etc. problem, to achieve the effect of improving recognition accuracy, increasing recognition distance, and sensing
CN104182736AActive Publication Date: 2014-12-03NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
Publication Date
2014-12-03

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Abstract

The embodiment of the invention provides a fingerprint identification sensor packaging structure and method. The packaging structure comprises a fingerprint identification sensor arranged above a silicon wafer and electrically connected with the silicon wafer, a color film layer arranged above the fingerprint identification sensor, a hard mask layer arranged above the color film layer and a substrate arranged below the silicon wafer, wherein at least one of the hard mask layer and the color film layer is doped with high dielectric particles. The packaging structure can improve identification accuracy of the fingerprint identification sensor.
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Description

technical field

[0001] The embodiment of the present invention relates to a biometric identification module packaging technology, in particular to a fingerprint identification sensor packaging structure and packaging method. Background technique

[0002] With the development of science and technology, electronic sensing technology is being applied more and more. At present, the fingerprint identification (finger printing) technology implemented by electronic sensing technology is the most mature and cheap biometric identification technology, which can be applied to notebook computers, mobile phones, automobiles, banks and other fields.

[0003] In the prior art, the fingerprint recognition sensor realized by the biometric identification technology is mainly a matrix-type capacitive fingerprint recognition sensor formed by a Complementary Metal Oxide Semiconductor (CMOS) process.

[0004] However, due to the existing capacitive fingerprint recognition sensor packaging struct...

Claims

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