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Substrate plating jig and plating device using same

A fixture and substrate technology, applied in the electrolysis process, electrolysis components, etc., to achieve the effects of uniform plating liquid flow, effective rotation force, and uniform film thickness

Inactive Publication Date: 2014-12-17
JCU CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, in the method of Patent Document 2, since the drive shaft is provided at a predetermined angle, it does not penetrate the side wall of the plating tank, but is provided at a predetermined angle or along the The angle of the axis to form the bottom of the plating tank, etc., still needs to be improved on the plating tank itself

Method used

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  • Substrate plating jig and plating device using same
  • Substrate plating jig and plating device using same
  • Substrate plating jig and plating device using same

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Embodiment Construction

[0031] Hereinafter, embodiments of a plating jig and a plating apparatus using the same according to the present invention will be described in detail with reference to the drawings. In addition, the present invention is not limited by these embodiments in any way.

[0032] figure 1 is an exploded perspective view of the plating jig of the present invention, figure 2 It is a schematic configuration diagram of a plating apparatus equipped with a plating jig of the present invention. The reference signs in the figure represent respectively as follows: 1 is a plating device, 2 is a plating fixture, 10 is a plating tank, 11 is a side wall, 12 is an ejection port, 20 is an overflow tank, 30 is a substrate support, 31 32 is a sealing member, 33 is an outer frame member, 34 is a shaft part, 35 is a fixing bolt, 36 is a fixing bolt, 37 is a fixing bolt, 40 is a supporting part, 41 is a hole part, 50 is an anode plate, 60 is a paddle, 70 is a power supply, 71 is a conduction path, ...

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Abstract

The present invention relates to a plating jig and a plating device that are used for substrate plating processing, and the purpose thereof is to provide a plating jig that has a rotation driving means for a substrate holder and, together with a support portion, is attachable to and detachable from a plating tank, and a plating device using the same. This plating jig is characterized by being configured from a support portion that is formed to be able to be hung on a plating tank side wall, and a substrate holder that is vertically rotatably provided to the support portion, and being provided with a rotation means for the substrate holder.

Description

technical field [0001] The present invention relates to a plating jig and a plating device used in the plating process of a substrate, and in particular to a device for forming fine grooves or holes for wiring, etc. A plating jig for forming a plating film at an opening portion of a semiconductor wafer, or forming bumps (protruding electrodes) electrically connecting a semiconductor chip and a substrate on a surface to be plated of a semiconductor wafer, and plating using the plating jig device. Background technique [0002] In general, the electrolytic plating method can be broadly classified into a jet stream in which the plated surface of a substrate such as a semiconductor wafer is placed face down and placed horizontally, and a plating solution is sprayed from below to apply plating. type or cup type; and the substrate is vertically erected in the plating tank, while injecting the plating solution from the bottom of the plating tank and making it overflow, while immers...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/06
CPCC25D17/001C25D17/06
Inventor 吉冈润一郎村山隆史
Owner JCU CORP
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