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Conjoined film laminating machine

A film machine and film wrapping technology, which is applied in packaging and other directions, can solve the problems of unguaranteed quality, time wasting, and easy generation of air bubbles, and achieve the effects of avoiding manual turning, overcoming cumbersome operations, and fast speed

Active Publication Date: 2017-01-04
苏州赛众自动化科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The automatic film laminating machine is also one of the automation equipment in this industry. It is used to paste the protective film of various products. Due to the small size of the product itself, air bubbles are easy to be generated during the film wrapping process. Inconvenient, such as it is difficult to complete this work without equipment, and it will waste a lot of time, the production capacity cannot be met, and the quality cannot be guaranteed

Method used

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  • Conjoined film laminating machine

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Embodiment Construction

[0013] The present invention will be further described below in conjunction with accompanying drawing.

[0014] One-piece film laminating machine, including back dust sticking platform 1, front sticking dust wheel 2, clamping mechanism 3, three-axis linkage mechanism 4, feeding mechanism 5, film wrapping mechanism 6, characterized in that the front sticking dust wheel 2 is set on the back On the left side of the dust-sticking platform 1, the three-axis linkage mechanism 4 is arranged on the left side of the dust-sticking platform 1 on the back. On the upper part of the film mechanism 6, the clamping mechanism 3 is arranged on the three-axis linkage mechanism 4 and is located on the right side. The clamping mechanism 3 drives the rotatable clamping heads to clamp the workpiece through the cylinders on both sides. There are multiple feeding mechanisms 5, and multiple feeding mechanisms 5 are arranged side by side. The coating mechanism 6 is provided with a coating cutter. The ...

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Abstract

The invention relates to a one-piece film laminating machine, which includes a dust sticking platform on the back, a dust sticking wheel on the front, a clamping mechanism, a three-axis linkage mechanism, a feeding mechanism, and a film wrapping mechanism. On the side, the three-axis linkage mechanism is set on the left side of the dust sticky platform on the back, the film wrapping mechanism is set on the upper part between the three-axis linkage mechanism and the dust sticky platform on the back, the feeding mechanism is set on the upper part of the film wrapping mechanism, and the clamping mechanism is set on the three-axis On the linkage mechanism and located on the right side, the clamping mechanism drives the rotatable clamping head to clamp the workpiece through the cylinders on both sides. The invention utilizes the characteristics of the product itself, adopts the principle of the servo motor and the cylinder, realizes the front and back flip positioning, thus solves the problem that the front and back of the product need to be flipped, avoids the manual flip action, realizes the fastest, and overcomes the difficulty of cumbersome operations by personnel , high speed and high efficiency.

Description

technical field [0001] The invention relates to the field of mechanical manufacturing, in particular to a one-piece film laminating machine. Background technique [0002] Electronic technology is an emerging technology developed at the end of the nineteenth century and the beginning of the twentieth century. It developed the fastest and was most widely used in the twentieth century, becoming an important symbol of the development of modern science and technology. [0003] The first generation of electronic products centered on the electron tube. At the end of the 1940s, the first semiconductor triode was born in the world. With the characteristics of small size, light weight, power saving, and long life, it was quickly used by various countries and replaced electronic tubes in a large range. In the late 1950s, the first integrated circuit appeared in the world, which integrated many transistors and other electronic components on a silicon chip, making electronic products mo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65B33/02
Inventor 孙丰
Owner 苏州赛众自动化科技有限公司
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