A Soluble Fixed Soft Abrasive Polishing Device Based on Refrigerating Sheet

Abstract

The invention discloses a soluble fixed soft abrasive polishing device based on a semiconductor refrigerating sheet. The main body of the polishing device is a polishing disc coated with fine abrasive particles on the surface. A semiconductor refrigerating sheet is installed on the back of the polishing disc. The temperature control belt is composed of semiconductor refrigeration sheets arranged in a ring; the cantilever guide rail equipped with a laser surface roughness measuring instrument is also installed above the polishing disc. The laser surface roughness measuring instrument is used to measure the surface roughness of the polishing disc to measure the distribution of fine abrasive Analyze the situation, and then adjust the surface flatness of the polishing disc by controlling the temperature of each lap of the temperature control belt. The invention uses a laser surface roughness measuring instrument to measure accurate data, which ensures that the abrasive grain layer is smoother, thereby ensuring higher processing precision; using semiconductor refrigeration chips to control the temperature, which is economical and convenient to control; changing the temperature of the fine abrasive grains Solubility, so that the whole device structure is simple and easy to control.

Description

Technical field [0001] The invention relates to the field of grinding and polishing, in particular to a soluble fixed soft abrasive polishing device based on a semiconductor refrigeration sheet. Background technique [0002] In modern polishing technology, the flatness of the polishing disk plays a vital role. During the polishing process, the entire circumference of the polishing disk is evenly coated with multiple layers of fine abrasives. During polishing, the polishing liquid is continuously sprayed on the fine abrasives. Above, the function of the polishing liquid is to dissolve the fine abrasive to dissolve the abrasive that is not sharp enough to complete the polishing work, and expose the new sharp abrasive in the lower layer to realize the self-renewal of the abrasive. However, due to the centrifugal force generated when the polishing disk rotates, the polishing liquid will always move to the periphery of the polishing disk, which results in the uneven distribution of th...

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Problems solved by technology

However, because the polishing liquid is subjected to the centrifugal force generated when the polishing disc rotates, the polishing liquid will always move to the periphery of the polishing disc, which leads to extremely uneven distribution of the polishing liquid on the entire polishing disc, that is, the polishing liquid near the center of the polishing disc There is less polishing liquid on the periphery of the polishing disc, which leads to the renewal of the abrasive on the periphery of the polishing disc faster than the abrasive near the center of the circle after grinding, which leads to the insufficient level of abrasive in the entire polishing disc, that is, the periphery is lower than the center. Affect the quality of polishing

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