Epoxy adhesive, manufacture and use thereof
An epoxy adhesive, epoxy resin technology, applied in the direction of adhesive types, polyurea/polyurethane adhesives, adhesives, etc., can solve problems such as excessive Tg reduction
Inactive Publication Date: 2015-01-28
DOW GLOBAL TECH LLC
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- Description
- Claims
- Application Information
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Problems solved by technology
Furthermore, additives that provide adhesives with acceptable E-modulus properties often result in an excessive reduction in Tg
Method used
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[0058] Certain embodiments of the present invention will now be described in the following examples, in which all parts and percentages are by weight unless otherwise indicated. .
[0059] Example compositions were cured at 180°C for 30 minutes.
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Abstract
The invention relates to epoxy adhesives. An epoxy adhesive is provided that simultaneously has low E-modulus and high glass temperature. Such adhesives are useful in the manufacture of large machinery (e.g., automobiles), and are useful for bonding different materials, such as metal and carbon fiber composite. The cured epoxy adhesive can be formulated to have an E-modulus of less than 1000 MPa, and a glass transition temperature of at least 80 C. The epoxy adhesive comprises a capped polyurethane prepolymer, a core shell rubber, and polyetheramine-epoxy adduct.
Description
technical field [0001] This invention relates to epoxy adhesive compositions, and to cured epoxy adhesives having a low E-modulus and a high glass transition temperature. Background technique [0002] Epoxy adhesives, including 1-component (1K) adhesives, are often used in industry, for example in the vehicle industry, to assemble parts made of similar materials (eg aluminum) or dissimilar materials. Bonding dissimilar materials such as carbon fiber composites, glass fiber composites, CFC / steel and CFC / aluminum, or other dissimilar materials can be complicated due to their different properties, such as different coefficients of thermal expansion. [0003] Structures or components based on CFC in combination with steel and / or aluminum are usually processed by electrocoating (e-coat). Because CFC substrates are very hard and have a different coefficient of thermal expansion than steel and aluminum, a low E-modulus is beneficial for the adhesive. However, low modulus adhesive...
Claims
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IPC IPC(8): C09J163/00C08G59/40
CPCC08L51/04C08G18/6674C08G18/4854C08G2650/50C08G59/50C09J175/04C09J163/00C08G18/12C08L71/02C08G18/285C08G18/643
Inventor C·布雷恩德利A·卢茨G·L·雅拉内拉
Owner DOW GLOBAL TECH LLC