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Washing device

A cleaning device and cleaning liquid technology, applied in cleaning methods and utensils, cleaning methods using liquids, electrical components, etc., can solve problems such as damage to wafer patterns, easy splashing, and inability to clean wafers, and achieve effective cleaning. , the effect of good continuity

Active Publication Date: 2015-02-11
ACM RES SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, if the flow rate of the chemical liquid in the nozzle is too fast, the chemical liquid will easily splash outward when sprayed to the edge of the wafer surface, so that the side of the wafer cannot be cleaned, and at the same time, the flow rate of the chemical liquid in the nozzle is too fast. The liquid flows to the middle area of ​​the wafer and damages the graphics in the middle area of ​​the wafer
If you want to reduce the flow rate of the chemical liquid in the nozzle, you have higher requirements for the accuracy of the flow control unit. Once the accuracy of the flow control unit deviates, the chemical liquid sprayed by the nozzle is intermittent, which will greatly reduce the edge of the wafer. cleaning effect

Method used

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Embodiment Construction

[0020] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0021] refer to figure 1 and figure 2 , discloses a schematic structural view and a schematic cross-sectional structural view of a cleaning device according to the present invention. The cleaning device includes a cleaning liquid delivery pipe body 110 and a detachable dripper 120 connected with the cleaning liquid delivery pipe body 110 . like figure 2 As shown, the cleaning fluid delivery pipe body 110 may further include a movable sleeve 111, and a conduit 112 for delivering cleaning fluid is arranged inside the sleeve 111.

[0022] to combine image 3 , the dripper 120 includes a hollow dripper housing 121, the top of the dripper housing 121 is provided with a liquid inlet 122, the bottom of the dripper housing 121 is provided wi...

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Abstract

The invention discloses a washing device which comprises a washing liquid conveying tube body and a dropper connected with the washing liquid conveying tube body, wherein the dropper comprises a hollow dropper shell; a liquid inlet is formed in the top of the dropper shell; a liquid outlet is formed in the bottom of the dropper shell; the dripper shell is filled with a sponge type filler; one side with the liquid inlet of the dropper shell is mounted at one end of the washing liquid conveying tube body. By filling the dropper shell with the sponge type filler, very well continuity of a washing liquid column oozed from the sponge type filler can be kept when the edge and the side surface of a wafer are washed by using the washing device, and thus the edge and the side surface of the wafer can be both effectively washed.

Description

technical field [0001] The invention relates to a cleaning device, in particular to a cleaning device capable of cleaning the edge of a wafer. Background technique [0002] Wafer cleaning is the most important and frequent step in the manufacturing process of semiconductor devices. With the rapid development of semiconductor technology, the continuous improvement of integration and the continuous shrinking of line width, the quality requirements of wafers are getting higher and higher. In the manufacturing process of semiconductor devices, almost every process is accompanied by wafer cleaning problems. The quality of wafer cleaning has an important impact on device performance. Improper handling may cause all wafers to be scrapped, or the performance of manufactured devices may Inferior, poor stability and reliability. Common wafer cleaning methods include wet cleaning, dry cleaning, megasonic cleaning, scrubbing, and high-pressure spraying. During the process, you can choo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/08B08B13/00
CPCB08B3/08H01L21/6704
Inventor 王坚贾照伟何增华王晖
Owner ACM RES SHANGHAI