Method for manufacturing printed circuit board and via thereof, and printed circuit board
A technology for printed circuit boards and production methods, which is applied in the directions of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of large copper reduction on the opposite side and long electroplating time, so as to reduce copper reduction and waste boards. rate, and the effect of improving stability
Inactive Publication Date: 2015-02-11
PEKING UNIV FOUNDER GRP CO LTD +2
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Problems solved by technology
[0011] Embodiments of the present invention provide a printed circuit board and a method for making a hole in a plate thereof, as well as a printed circuit board, so as to solve the problem of copper on the opposite side when making an existing printed circuit board with a hole in a partially thick copper plate. The amount of copper reduction is large, and the plating time is long, etc.
Method used
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Embodiment Construction
[0037] In the embodiment of the present invention, the hole in the plate is plated separately, which reduces the scrap rate of the circuit board; and controls the thickness of the copper on the surface of the circuit board within a reasonable range, avoids or reduces the amount of copper reduction of the surface copper, and improves the circuit board. The uniformity of copper on the board surface improves the stability of current transmission and the heat dissipation capacity of the circuit board, and also reduces the scrap rate of printed circuit boards.
[0038] The embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0039] Such as figure 2 As shown, it is a method for manufacturing a hole in a plate of a printed circuit in an embodiment of the present invention, and the method includes:
[0040] Step 201: making holes in the plate corresponding to the thick copper area on the circuit board, and pe...
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The invention relates to the technical field of printed circuit boards and especially to a method for manufacturing a printed circuit board and a via thereof, and a printed circuit board. The method solves problems of large surface copper removing amount and long electroplating time in the manufacture of a printed circuit board containing a via with local thick copper in the prior art. The method employs two-time electroplating technology. The thickness of via copper and surface copper are controlled when the circuit board is electroplated at the first time. Just the via with local thick copper is electroplated at second-time electroplating. Thus, problems of long electroplating time, an increased unqualified circuit board rate, and large surface copper removing amount which are used for achieving the via hole thickness are prevented. The two-time electroplating decreases the unqualified circuit board rate, controls the surface copper thickness of the circuit board to be within a reasonable range, prevents the surface copper from being removed, and improves the current transmission stability and the heat-dissipating capability of the circuit board.
Description
technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a printed circuit board, a hole in a plate thereof, and a printed circuit board. Background technique [0002] The thicker copper layer in the printed circuit board can enhance the stability of the current transmission of the circuit board, and at the same time can improve the heat dissipation capacity of the circuit board. Therefore, when the circuit board is required to have high reliable withstand voltage capability, stable transmission capability and good heat dissipation capability, some holes in the circuit board will be designed as local thick copper, and at the same time, in order to reduce the wiring density of the circuit board and improve heat dissipation capability, these localized thick copper vias can be designed as vias in the pad. [0003] Such as figure 1 As shown, it is a method for making a hole in a local thick coppe...
Claims
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IPC IPC(8): H05K1/11H05K3/42
CPCH05K1/113H05K3/425H05K3/429H05K2201/09563H05K2201/0959
Inventor 李金鸿陈显任罗龙
Owner PEKING UNIV FOUNDER GRP CO LTD