DMD (Dacron/Mylar/Dacron) flexible composite material adhesive

A technology of composite materials and adhesives, applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve the problems of large internal stress, impact resistance, poor crack resistance and heat and humidity resistance, shrinkage Low problems, to achieve the effect of excellent bond strength

Inactive Publication Date: 2015-02-18
绵阳润缘电工材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] ③Low shrinkage
[0012] ①When the epoxy resin is not toughened, the cured product is generally brittle and has poor flexibility, which limits its application in the machinery manufacturing industry; at the same time, its temperature resistance is also poor, generally only below 150°C long-term use
[0014] In addition, after curing, epoxy resin has disadvantages such as large internal stress, brittle quality, poor impact resistance, crack resistance and moisture resistance, which largely limit its application in some high-tech fields, especially In the development of new motors and electrical products, there are higher requirements for the heat resistance of epoxy resin adhesives, but ordinary epoxy resin adhesives have poor heat resistance, so they need to be modified , increase its heat resistance, and enhance its application in motor insulation materials

Method used

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  • DMD (Dacron/Mylar/Dacron) flexible composite material adhesive
  • DMD (Dacron/Mylar/Dacron) flexible composite material adhesive
  • DMD (Dacron/Mylar/Dacron) flexible composite material adhesive

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preparation example Construction

[0037] The preparation method of DMD soft composite material adhesive provided by the invention comprises the following steps:

[0038] Step 1: adding epoxy resin, phenolic resin and polyurethane resin to acetone and mixing, stirring evenly to obtain a mixed resin solution;

[0039] Step 2: Add the curing agent and the accelerator into the mixed resin solution, and stir evenly to obtain the adhesive.

[0040] The consumption of described acetone is 2-5 times of epoxy resin consumption.

Embodiment 1

[0042] Preparation of curing agent: Add 120 parts by weight of dry vegetable oil and 60 parts by weight of imine monomer into the reaction kettle, heat it with microwave to 100°C, stir and react for 3 hours, add 30 parts by weight of maleic anhydride, and stir and react at 150°C After 5 hours, a curing agent was obtained.

[0043] Preparation of the adhesive: 35 parts by weight of polyphenol glycidyl ether epoxy resin, 10.5 parts by weight of phenol-formaldehyde resin and 22.5 parts by weight of polyurethane resin were mixed in 70 parts by weight of acetone, and stirred evenly to obtain a mixed resin solution; Add the curing agent in parts by weight and the triethanolamine accelerator in 2 parts by weight into the mixed resin solution, and stir evenly to obtain the adhesive.

Embodiment 2

[0045] Preparation of curing agent: Add 100 parts by weight of dry vegetable oil and 50 parts by weight of imine monomer into the reaction kettle, heat it with microwave to 150°C, stir and react for 5 hours, add 40 parts by weight of maleic anhydride, stir and react at 180°C After 4 hours, a curing agent was obtained.

[0046] Preparation of adhesive: Add 35 parts by weight of glycidylamine epoxy resin, 15 parts by weight of p-tert-butylphenol formaldehyde resin and 20 parts by weight of polyurethane resin into 140 parts by weight of acetone and mix them evenly to obtain a mixed resin solution ; Add 25 parts by weight of curing agent and 5 parts by weight of accelerator triethanolamine into the mixed resin solution, and stir evenly to obtain an adhesive.

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Abstract

The invention discloses a DMD (Dacron / Mylar / Dacron) flexible composite material adhesive which comprises the following components in percentage by weight: 30-40% of epoxy resin, 5.5-15.5% of phenol formaldehyde resin, 17.5-27.5% of polyurethane resin, 25-35% of curing agent and 1-5% of accelerator. The preparation method of the DMD flexible composite material adhesive comprises the following steps: adding the epoxy resin, phenol formaldehyde resin and polyurethane resin into acetone, and stirring uniformly to obtain a mixed resin solution; and adding the self-made curing agent and accelerator into the mixed resin solution, and stirring uniformly to obtain the adhesive. The raw material epoxy resin has excellent binding strength and dielectric property, and the phenol formaldehyde resin has higher heat resistance, so the prepared adhesive has the advantages of high temperature classification, high curing speed and the like; and thus, the adhesive can satisfy the technical requirements for producing the DMD flexible composite material.

Description

technical field [0001] The invention relates to the field of composite materials, in particular to an adhesive suitable for motor insulation materials and a preparation method thereof. Background technique [0002] There are many types of adhesives, which can be divided into organic, inorganic, and natural synthesis according to their properties. Adhesive is a substance that can bond two materials with different properties together and has a strong structural strength after curing. In recent years, adhesives have developed rapidly and are widely used, and have been gradually applied to the connection of insulating materials. [0003] Among many synthetic adhesives, epoxy resin adhesive is a kind of adhesive with good adhesion and is widely used. It was once known as "universal glue" and "vigorous glue". Epoxy resin adhesives can replace welding, riveting, and bolting in traditional mechanical processes, and are widely used in aviation, automobiles, light industry machinery...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J175/04C08G59/42C08G59/64C08G59/62
Inventor 韩培波
Owner 绵阳润缘电工材料有限公司
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