A kind of manufacturing method of metalized counterbore in pcb
A manufacturing method and technology of metallized holes, which are applied in the manufacture of printed circuits, the formation of electrical connections of printed components, electrical components, etc., can solve the problems of poor copper plating effect, poor exchange of electroplating chemicals, etc., achieve good conductivity and avoid open circuit problems Effect
Active Publication Date: 2017-11-28
JIANGMEN SUNTAK CIRCUIT TECH
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Problems solved by technology
[0003] The present invention aims at making metallized counterbore with aspect ratio ≥ 1:1 and hole depth ≥ 1.0mm in PCB, due to the poor exchange of electroplating chemicals and poor copper plating effect on the bottom of metallized counterbore, so that there is no copper at the bottom of metallized counterbore. This leads to the problem of open circuits, and provides a metallized counterbore manufacturing method with good electroplating effect and no open circuit due to poor electroplating of metallized counterbore holes
Method used
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Embodiment
[0022] refer to Figure 1-5 , the present embodiment provides a method for manufacturing a metalized counterbore in a PCB, and the parameters of the PCB manufactured by this method are as follows:
[0023]
[0024] The specific production steps are as follows:
[0025] (1) Fabrication of Metallized Hole Wall 14
[0026] Make the inner pattern on the core board, then press the core boards together to form the first multilayer board 10, and one surface of the first multilayer board 10 is the first outer layer 11, and the other surface is the first inner layer. Layer 12. Drill through-holes on the first multi-layer board 10 where metallized counterbores need to be made, and then metallize the through-holes by sinking copper and electroplating the entire board to obtain metallized wall holes 14 . After full board electroplating, make anti-plating layer on the first inner layer 12, then respectively copper-plated and tin-plated on the copper surface of metallized wall hole 14...
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The invention relates to the technical field of PCB manufacturing, in particular to a method for manufacturing metalized sink holes in a PCB. The present invention divides the metallized counterbore into two parts for production, and then presses the two parts together to form the metallized counterbore, which can ensure good electroplating effect on the hole wall and bottom of the metallized counterbore, without missing plating Therefore, the open circuit problem caused by poor plating at the bottom of the metalized counterbore can be avoided. Pouring conductive material into the metallized counterbore can further ensure good electrical conductivity of the metallized counterbore, and because there is no missing plating or too thin copper plating in the metallized counterbore, the conductive material can still be used in harsh environments such as high temperature. It can be firmly attached to the bottom of the metallized counterbore, closely bonded to the electroplated copper layer at the bottom of the metallized counterbore, and the conductive material will not fall off.
Description
technical field [0001] The invention relates to the technical field of PCB manufacturing, in particular to a method for manufacturing metalized sink holes in a PCB. Background technique [0002] With the application of electronic products such as mobile phones, digital cameras, notebook computers, car navigation systems and IC packaging, coupled with the enhancement of the functions of electronic products and the miniaturization and integration of electronic products, the accuracy requirements of PCB Also keep improving. In the production of PCB, it is often necessary to make metalized sink holes on the PCB. The manufacturing method of existing metallized counterbore is usually: at first each core board that has made inner circuit is pressed together to form multilayer board, then drill counterbore on multilayer board (also need to drill through hole and Blind holes, etc.), the drilled counter holes are metallized by sinking copper and full-board electroplating, thereby fo...
Claims
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IPC IPC(8): H05K3/42
CPCH05K3/429
Inventor 黄力汪广明白会斌王海燕
Owner JIANGMEN SUNTAK CIRCUIT TECH