Novel liquid immersion cooling device

Abstract

The invention provides a novel liquid immersion cooling device which comprises an upper liquid storage bin, a lower liquid storage bin, a fin plate, a water inlet, a water outlet, TEC refrigerating chips, partitions and fins, wherein the upper liquid storage bin is connected with the lower liquid storage bin and separated from the lower liquid storage bin through the fin plate; the TEC refrigerating chips are fixed on the upper surface of the fin plate; the cold surfaces of the TEC refrigerating chips are in contact with the fin plate; a partition is inserted between every two adjacent TEC refrigerating chips; the fins are uniformly arranged on the lower surface of the fin plate; the water inlet is formed in the side wall of the upper liquid storage bin; the water outlet is formed in the side wall of the upper liquid storage bin. The novel liquid immersion cooling device has the advantages and benefits that due to the adoption of the TEC refrigerating chips, the problems of difficult temperature adjustment, difficult maintenance and damage of flowing of cooling liquid on the chips in the conventional liquid immersion cooling system are solved; a proper amount of cooling liquid is added and a proper amount of airbags are reserved, so that the liquid overflow caused by thermal expansion and cold contraction of the liquid can be prevented; due to the design of the partitions, the cooling liquid can uniformly flow through the TEC refrigerating chips.

Description

technical field [0001] The invention belongs to the field of heat conduction structures, and in particular relates to a liquid immersion heat dissipation structure with high efficiency, energy saving, simple manufacture and low cost. Background technique [0002] With the improvement of performance requirements for high-performance computers, supercomputers, ASIC chips, and data centers in professional fields, the motherboard array group is getting larger and larger, but the heat dissipation problem limits the further expansion of the corresponding motherboard or electronic chip array. Traditional air cooling and liquid cooling can no longer solve the heat dissipation problem of professional chips. Even if it can be solved, it will cause huge noise or power consumption. [0003] The traditional heat dissipation structure mainly dissipates heat for heat-generating areas, and the deployment of heat dissipation devices or pipes is difficult, requiring multiple steps to complete...

AI Technical Summary

Problems solved by technology

[0004] Liquid immersion heat dissipation is mainly passive heat dissipation, but the flexibility of this heat dissipation method is relatively poor, and the liquid immersion temperature cannot be flexibly controlled, which limits the use of liquid immersion systems to a certain extent

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