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Three-dimensional analysis system and method for product assembly clearance

An analysis system and analysis method technology, which is applied in the field of three-dimensional analysis system for product assembly gaps, can solve the problems of product scrapping, failure to remove, and inability to perform three-dimensional measurement

Inactive Publication Date: 2018-07-06
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Application Information

AI Technical Summary

Problems solved by technology

The traditional method of measuring the assembly gap of products is to use calipers or three-dimensional coordinate measuring equipment to measure points or collect corresponding points in the gap between assembled products. This traditional measurement method cannot achieve three-dimensional measurement of the entire shape and surface, and the measurement speed of collecting points is very slow.
Nowadays, many products are assembled without screws such as hooks, springs, and glue. Once assembled, they cannot be removed. If they are removed, the product will be scrapped.

Method used

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  • Three-dimensional analysis system and method for product assembly clearance
  • Three-dimensional analysis system and method for product assembly clearance

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Embodiment Construction

[0026] Refer to figure 1 Shown is a schematic diagram of the operating environment of the preferred embodiment of the product assembly gap three-dimensional analysis system 10 of the present invention. In this embodiment, the product assembly gap three-dimensional analysis system 10 is installed and operated in a computer 1, and the computer 1 also includes, but is not limited to, a display device 11, a storage device 12 and a processor 13. The computer 1 is connected to an optical three-dimensional scanner 2, which is a binocular optical point cloud three-dimensional detection device (charge-coupled device, CCD), which is used to measure the product gap between two unassembled parts Partially or perform point cloud scanning on the gap part of the assembled product to obtain the product gap point cloud. The product assembly gap three-dimensional analysis system 10 calculates the three-dimensional space distance of the product assembly gap according to the product gap point clou...

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Abstract

A three-dimensional analysis system and method for a product assembly gap is applied to a computer connected with an optical three-dimensional scanner. The product assembly gap three-dimensional analysis system and method can use an optical three-dimensional scanner to scan the product gap part between unassembled parts or the assembled product gap part to obtain the product gap point cloud, according to The scanned product gap point cloud calculates the three-dimensional space distance of the product assembly gap, uses the color tolerance zone to color-mark the product assembly parts and the surface of the assembled parts to represent the product assembly gap, and generates a three-dimensional color scale analysis of the entire product assembly gap picture.

Description

Technical field [0001] The invention relates to a product measurement system and method, in particular to a product assembly gap three-dimensional analysis system and method. Background technique [0002] Product assembly is one of the most important links in the entire production process. During product assembly, the product assembly gap between parts is an important indicator of product quality. The traditional method of measuring the product assembly gap is to use calipers or three-dimensional coordinate measuring equipment to make dots or collect corresponding point measurements at the gap of the assembled product. This traditional measurement method cannot achieve the three-dimensional measurement of the entire surface, and the measurement speed of the collection point is very slow. . Many products are now assembled using hooks, springs, glue and other screwless methods. Once assembled, they cannot be removed. If they are removed, the product will be scrapped. Summary of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/14
CPCG06Q10/06G06Q50/04Y02P90/30
Inventor 张旨光吴新元
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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