Processing method of printed circuit board

Abstract

The invention is applicable to the technical field of printed circuit boards and provides a processing method of a printed circuit board and aims at solving a problem, which exists in the prior art, that before lamination, when a blind hole is drilled in a core board, core board fracture or fold is likely to happen. The method includes the following steps: a pre-procedure: laminating an outer-layer substrate, a prepreg and another outer-layer substrate sequentially and carrying out lamination processing so as to form a multi-layer printed circuit board; hole processing: processing a blind hole, which extends from the core board to the prepreg, in the multilayer printed circuit board; copper deposition: carrying out copper deposition processing on the blind-hole printed circuit board so as to form a copper layer; hole filling: using a filler to fill the blind hole fully; and outer-layer processing: manufacturing a line pattern. Through blind-hole processing on the multilayer printed circuit board after the lamination processing and hole filling processing of the blind hole, electrical connection with the inner-layer core board is realized so that a problem that in a process of hole processing in the inner-layer core board, fracture or fold happens is solved so that realization of high-density interconnection of printed circuit boards is facilitated.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, in particular to a processing method for printed circuit boards. Background technique [0002] With the rapid development of electronic technology, electronic products gradually tend to be miniaturized, lightweight, and highly integrated, and printed circuit boards are indispensable components of electronic products, which inevitably requires printed circuit boards to be small and lightweight and high density. The high density of printed circuit boards depends on the blind holes and lines connected between layers, and depends on the performance of electronic products. Therefore, the production of blind holes in printed circuit boards has become one of the keys to the development of printed circuit board technology. [0003] Generally, for a multi-layer printed wiring board, blind holes include blind holes extending from the outer surface of the printed wiring board to inner layers...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method for processing printed circuit boards, which adopts the method of processing blind holes on the printed circuit board after lamination and filling the blind holes, aiming to solve the problems in the prior art before lamination. When drilling blind holes on the board, it is easy to break or crease the core board

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