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Water jet assisted laser chemical etching device and method

An auxiliary laser and chemical etching technology, applied in laser welding equipment, manufacturing tools, welding equipment, etc., can solve the problems affecting the surface processing quality of materials, residual thermal stress and micro cracks, and small thermal influence, etc., to achieve good processing effect , low pressure and low cost

Inactive Publication Date: 2015-03-25
JIANGNAN UNIV
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  • Application Information

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Problems solved by technology

[0003] Compared with traditional processing methods, laser etching is a non-contact, non-cutting, heat-affected, clean and special surface processing method. Laser etching technology is a commonly used laser processing technology. , which makes laser etching difficult-to-machine materials a

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  • Water jet assisted laser chemical etching device and method
  • Water jet assisted laser chemical etching device and method

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Embodiment Construction

[0028] In order to make the technical solution of the present invention more clearly expressed, the present invention will be further described below in conjunction with the accompanying drawings.

[0029] see figure 1 , a device for water jet assisted laser chemical etching, comprising:

[0030] (1) Laser system;

[0031] (2) Water jet system;

[0032] (3) Chemical system.

[0033] The laser system includes a mirror (9), a laser beam (8), an auxiliary gas oxygen (7), and a laser head (6). The current intensity of the laser is 120-200A, the pulse width is 0.4-1.8ms, and the pulse repetition frequency is 20 ~50HZ, the defocus amount is 1~3mm, and the laser scanning speed is 0.6~1.5mm / s. The laser beam (8) generated by the laser system is finally emitted from the laser head (6).

[0034] The angle between the water jet beam (10) and the laser beam (8) of the water jet system is 5-80°, the diameter of the water jet beam is 6-9 mm, and the flow rate of the water jet beam is ad...

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Abstract

The invention discloses a water jet assisted laser chemical etching device and method and belongs to the application field of non-traditional machining. The water jet assisted laser chemical etching device consists of three systems including a laser system, a water jet system and a chemical system and is characterized in that the high energy of laser and the washout effect of water jets are firstly utilized to jointly machine material surface, a hand-cranking wheel is turned to enable a material to be completely immersed into chemical liquid through a lifting worktable after primary machining is finished, and molten slag on the machined material surface can be decreased as far as possible and the thickness of a recast layer is decreased under the corrosive effect of the chemical liquid. By means of the water jet assisted laser chemical etching device and method, required grooves can be formed in the machined material surface in an etching mode, obvious molten slag, the recast layer and the like do not exist on the surfaces of the grooves, and according good machining effect is obtained.

Description

Technical field: [0001] The invention relates to the application field of special processing, in particular to a water jet assisted laser chemical etching device and method. Background technique: [0002] With the development of materials engineering, difficult-to-machine materials have gradually become the key research objects in the field of mechanical processing. Scientifically speaking, taking the cutting performance of the material as a measure, the hardness > HB250, the strength σ > 1000MPa, the elongation > 80%, and the impact value α > 0.98MJ / m 2 Materials with thermal conductivity k<41.8 are collectively referred to as difficult-to-machine materials. Difficult-to-machine materials are favored in various engineering fields. Some of these fields need to engrave round grooves on the surface of the material, and some need to etch round holes on the surface. However, due to the high hardness and brittleness of these materials, conventional turning, grind...

Claims

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Application Information

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IPC IPC(8): B23K26/362B23K26/146B23K26/142C23F1/08
CPCC23F1/08
Inventor 袁根福谢兵兵
Owner JIANGNAN UNIV