A kind of automatic production device and method of soaking plate liquid absorbing core

Abstract

The invention discloses a device and method for automatically producing vapor chamber liquid absorbing cores. The device comprises a pattern printing device, a copper plate lead-in device, a heat transfer device, a spraying device, a drying and solidifying device and a corrosion device, wherein the pattern printing device is used for printing patterns to heat transfer paper, the copper plate lead-in device is used for accurately leading copper plates into the heat transfer device, the heat transfer device is used for transferring the patterns on the heat transfer paper to the copper plates, the spraying device is used for evenly spraying liquid-state photoresist to the other faces and the lateral faces of the copper plates, the drying and solidifying device is used for carrying out heating drying and solidifying of the copper plates with the sprayed liquid-state photoresist, and the corrosion device is used for corroding the to-be-corroded copper plates. The device and method can be used for rapidly and automatically producing vapor chambers in a batch mode. The needed patterns are transferred to copper plate workblanks through heat transferring, the liquid-state photoresist is sprayed to the other faces and the lateral faces of the copper plates, corrosion resistant molds are formed after infrared heating drying and ultraviolet projection solidification, the to-be-corroded copper plates are obtained, and the liquid absorbing cores can be obtained after the to-be-corroded copper plates are corroded by corroding liquid for a certain period of time and demolding processing and carbon deposition matter cleaning processing are carried out.

Description

technical field [0001] The invention relates to processing equipment for a liquid-absorbing core and a preparation process thereof, in particular to an automatic production device and method for a soaking plate liquid-absorbing core. Background technique [0002] With the rapid development of science and technology in the field of optoelectronics, optoelectronic products, such as LED lighting and display technology, ultra-high performance microcomputer CPU technology have made great progress, but the corresponding heat dissipation technology is far behind the development speed of optoelectronic products, heat dissipation problems increasingly serious. [0003] At present, the heat dissipation equipment with the most development potential and prospect is the vapor chamber. The vapor chamber is a phase change heat transfer element used to provide a large isothermal surface. It is a special form of a flat heat pipe and is mainly composed of a wall shell, a capillary wick and a...

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Problems solved by technology

However, due to the uncertainty of the microstructure arrangement of the liquid-absorbent core produced by the two, its performance is also unstable.

[0005] In the prior art, the main transport channel of a new vapor chamber liquid-absorbing core is connected with the central condensation area, and the central condensation area is used as the common starting point, and the veins of the binary tree structure are evenly distributed on the condensation base plate in the form of leaf veins on the edge of the condensation base plate. Therefore, its microstructure and pore size are uniformly distributed and determined, and its performance is more stable. However, this structure cannot be processed by traditional powder sintering and multi-layer copper mesh technology.

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