Method for verifying product reliability through temperature-stress-increased accelerated lift test

Abstract

The invention provides a method for verifying the product reliability through a temperature-stress-increased accelerated lift test. The method includes the steps that the initial temperature in a temperature-stress-increased test is firstly determined, then temperature accelerated factors and single-sample testing time of the temperature-stress-increased test are determined, the number of efficacy losing samples is further calculated, a temperature-stress-increased reliability verification test is finally carried out, the number of faults of the samples is counted, the number of the faults is compared with the number of the efficacy losing samples, and the test can be completed. By means of the method, under the condition that a fault mode and a fault mechanism are not changed, the testing time can be shortened, the test expenditure and the manpower expenditure can be saved, and the practical level of the mean time between faults of products can be accurately verified.

Description

technical field [0001] The invention relates to the reliability verification of electronic products only affected by temperature, which can obtain test data with a high level of confidence in the case of less time spent and a small number of samples, and is a method for verifying the mean interval between failures of such products Time-to-Time (MTBF) Actual Level Approach. Background technique [0002] At present, the reliability index verification of products is generally carried out through reliability tests. The traditional reliability test is a test made with a representative product under specified conditions, and the specified conditions refer to the normal stress conditions when the product is working. During the whole test process, the load and use of the product are operated under normal working stress. According to the statistics of the test results, the cumulative test time of the product and the number of failures to determine whether the product reliability mee...

AI Technical Summary

Problems solved by technology

[0003] In recent years, with the rapid improvement of the level of components, there are more and more products with high reliability and long life, especially when the reliability data samples of electronic products are few, and the life distribution cannot be determined, even if the distribution type is solved There is also a problem of confidence in the relevant analysis results, and for large and complex electronic products, the traditional reliability test is carried out under normal stress levels, the test period is too long, the test cost is high, and it takes a long time , can no longer meet the actual needs

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