Unlock instant, AI-driven research and patent intelligence for your innovation.

Device and method for printed circuit board with embedded cable

A technology of printed circuit board and cable structure, which is applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc.

Inactive Publication Date: 2015-03-25
HUAWEI TECH CO LTD
View PDF5 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the materials used for the adhesive layer and dielectric layer may be limited by the structural requirements of the MWB

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device and method for printed circuit board with embedded cable
  • Device and method for printed circuit board with embedded cable
  • Device and method for printed circuit board with embedded cable

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The making and using of the presently preferred embodiments are discussed in detail below. It should be appreciated, however, that the present invention provides many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative of specific ways to make and use the invention, and do not limit the scope of the invention.

[0017] Embodiments will be described in the context of a printed circuit board (PCB), and in particular, a multi-wiring board (MWB).

[0018] Embodiment apparatus and methods provide a pair of pre-insulated inner conductors embedded within a printed wiring board surrounded by a shielding cover. Embodiments generally provide a high speed system with low losses. Embodiments provide a high speed system with low passive channel insertion loss at relatively low cost. Embodiments may be implemented in devices such as backplanes, line cards, switching NICs, etc. in high...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A printed circuit board (PCB) includes a first dielectric layer and a differential cable structure embedded in the dielectric layer. The differential cable structure includes a first inner conductor, a second inner conductor, a dielectric surrounding portions of the first inner conductor and portions of the second inner conductor, and a ground shield surrounding the dielectric.

Description

[0001] Related Applications Cross Application [0002] This application claims prior application priority to US Provisional Application No. 61 / 676,216, filed Jul. 26, 2012, entitled "Apparatus and Method for Printed Circuit Boards with Embedded Cables," and claims 2013 Priority priority to U.S. Patent Application No. 13 / 907,344, filed May 31, entitled "Apparatus and Method for Printed Circuit Boards with Embedded Cables," the contents of which are incorporated by reference in incorporated into this text in the same manner as if reproduced in full. technical field [0003] The present invention relates to an apparatus and method for a printed circuit board, and in particular embodiments, to an apparatus and method for a printed circuit board with embedded cables. Background technique [0004] Broadly speaking, a multi-wiring board (MWB) is a printed wiring board (PWB) or printed circuit board (PCB) having pre-insulated conductor (eg, copper) lines embedded in a dielectric la...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11
CPCH05K1/0245H05K3/103H05K3/4644H05K2201/10356H05K1/11
Inventor 于飞严航高峰
Owner HUAWEI TECH CO LTD