Solder alloy, solder paste, and electronic circuit board

一种线路基板、焊锡膏的技术，应用在印刷电路、印刷电路制造、用电元件组装印刷电路等方向，能够解决耐疲劳性耐冷热疲劳性劣化、连接不良、降低银等问题，达到抑制气孔、确保润湿性、低成本化的效果

Active Publication Date: 2015-04-01
HARIMA CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] On the other hand, since the silver contained in the tin-silver-copper alloy is very expensive, it is required to reduce the silver content from the viewpoint of cost reduction.
However, when the silver content is simply reduced, the fatigue resistance (especially cold and heat fatigue resistance) deteriorates, which may cause poor connection, etc.

Method used

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  • Solder alloy, solder paste, and electronic circuit board
  • Solder alloy, solder paste, and electronic circuit board
  • Solder alloy, solder paste, and electronic circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～41 and comparative example 1～7

[0100] Modulation of Solder Alloy

[0101] Powders of the respective metals listed in Tables 1 to 3 were mixed according to the compounding ratios listed in Tables 1 to 3, and the obtained metal mixture was melted and homogenized in a melting furnace to prepare a solder alloy. The compounding ratio of tin (Sn) in the compounding formula of each embodiment and each comparative example is to subtract each metal (silver (Ag), copper (Cu), bismuth (Bi), antimony (Sb) recorded in Tables 1 to 3 ), nickel (Ni), indium (In), cobalt (Co) and germanium (Ge)) in the proportion (mass %) of the remainder.

Embodiment 1

[0102] In the solder alloy of Example 1, each metal of Ag, Cu, Bi, Sb, Ni, and In was mixed in the ratio shown in Table 1, and the remainder was Sn. In Example 2, Co was further added to the formulation of Example 1.

[0103] Examples 3-8 are the examples of the formulation which changed the compounding ratio of Bi from the formulation of Example 1.

[0104] Examples 9 and 10 are examples of formulations in which the compounding ratio of Sb and the value of the mass ratio Bi / Sb of the compounding amounts of Bi and Sb are changed from the compounding ratio of Example 4.

[0105] Examples 11 to 16 are examples of formulations in which the mixing ratio of In is changed from the formulation of Example 1.

[0106] Examples 17 and 18 are examples of formulations in which the compounding ratio of Sb and In and the value of the mass ratio In / Sb of the compounding amounts of In and Sb are changed from the compounding ratio of Example 1.

[0107] Examples 19 and 20 are examples of for...

Embodiment 21

[0108] Example 21 is an example of a formulation in which the blending ratio of Cu was changed from the formulation of Example 1.

[0109] Examples 22 to 36 are examples of formulations in which Co was further blended with respect to the formulations of Examples 4 to 7, 9 to 10, 12 to 15, and 17 to 21.

[0110] Examples 37 to 39 and Comparative Examples 3 and 4 are examples of formulations in which the compounding ratio of Sb was changed from the formulation of Example 1.

[0111] The solder alloys of Examples 40 to 41 and Comparative Example 5 are examples of formulations in which the mixing ratio of Ag is changed from the formulation of Example 1.

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Abstract

This solder alloy is a tin-silver-copper-based solder alloy, contains tin, silver, copper, nickel, antimony, bismuth, and indium, essentially does not contain magnesium, and with respect to the total quantity of solder alloy, has a silver content of 0.05-0.2 mass% exclusive and an antimony content of at least 0.01 mass% and less than 2.5 mass%.

Description

technical field [0001] The present invention relates to a solder alloy, a solder paste, and an electronic circuit board. Specifically, it relates to a tin-silver-copper-based solder alloy, a solder paste containing the solder alloy, and an electronic circuit board obtained using the solder paste. Background technique [0002] Generally, solder joints using solder paste are used for metal joints in electric and electronic devices, and lead-containing solder alloys have been used in such solder pastes conventionally. [0003] However, in recent years, the use of lead has been required to be suppressed from the viewpoint of environmental burden, and therefore lead-free solder alloys (lead-free solder alloys) have been developed. [0004] As such lead-free solder alloys, known are, for example, tin-copper alloys, tin-silver-copper alloys, tin-bismuth alloys, tin-zinc alloys, etc., especially tin-silver-copper alloys. It is widely used due to its excellent strength. [0005] On...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K1/00C22C13/00C22C13/02H05K3/34B23K35/22B23K35/363B23K101/42
CPCB23K1/0016B23K35/0244B23K35/025B23K35/262C22C13/00C22C13/02H05K3/3463B23K35/22B23K1/00B23K35/26H05K1/092
Inventor 今村阳司池田一辉朴锦玉竹本正
Owner HARIMA CHEM INC
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