Solder alloy, solder paste, and electronic circuit board

Abstract

This solder alloy is a tin-silver-copper-based solder alloy, contains tin, silver, copper, nickel, antimony, bismuth, and indium, essentially does not contain magnesium, and with respect to the total quantity of solder alloy, has a silver content of 0.05-0.2 mass% exclusive and an antimony content of at least 0.01 mass% and less than 2.5 mass%.

Description

technical field

[0001] The present invention relates to a solder alloy, a solder paste, and an electronic circuit board. Specifically, it relates to a tin-silver-copper-based solder alloy, a solder paste containing the solder alloy, and an electronic circuit board obtained using the solder paste. Background technique

[0002] Generally, solder joints using solder paste are used for metal joints in electric and electronic devices, and lead-containing solder alloys have been used in such solder pastes conventionally.

[0003] However, in recent years, the use of lead has been required to be suppressed from the viewpoint of environmental burden, and therefore lead-free solder alloys (lead-free solder alloys) have been developed.

[0004] As such lead-free solder alloys, known are, for example, tin-copper alloys, tin-silver-copper alloys, tin-bismuth alloys, tin-zinc alloys, etc., especially tin-silver-copper alloys. It is widely used due to its excellent strength.

[0005] On...

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