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Automatic IC (integrated circuit) charging-tray chip transferring machine

An automatic transfer and tray technology, applied in transportation, packaging, storage devices, etc., can solve the problems of affecting production quality, high labor intensity, damage to chips, etc., and achieve the effect of compact and practical structure, high degree of automation, and high production efficiency.

Active Publication Date: 2015-04-08
深圳格芯集成电路装备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, many companies rely on manual methods to transfer chips from small trays to large trays. This method is not only inefficient (800-1000 grains / hour. person), labor-intensive, but also easy to reverse and damage Chips affect subsequent production quality

Method used

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  • Automatic IC (integrated circuit) charging-tray chip transferring machine
  • Automatic IC (integrated circuit) charging-tray chip transferring machine
  • Automatic IC (integrated circuit) charging-tray chip transferring machine

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach

[0055] The specific implementation method is: two small tray conveying guide rails 1015 are fixedly connected with the small tray conveying guide rail bracket 1022 fixedly mounted on the large mounting plate 1010;

[0056] The hook mobile motor 1025 and the synchronous belt transmission assembly driven by it are fixed on the large mounting plate 1010, and the guide rail of the hook linear guide rail 1021 is also fixed on the large mounting plate 1010, supporting a part of the hook 1024 and the hook The slide block of linear guide rail 1021 is fixedly connected, and the other part of support hook 1024 is connected with hook hand synchronous belt 1016 firmly. When the small material tray in the clip was pushed into the small material tray delivery guide rail 1015 by the pusher 1013, the first sensor 1037 light was on, and the pusher 1013 would continue to push until the second sensor 1038 light was on (at this time the first sensor 1037 light off), the pusher 1013 stops pushing ...

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PUM

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Abstract

The invention discloses an automatic IC (integrated circuit) charging-tray chip transferring machine capable of descending and conveying a magazine clip of a small charging tray step by step, pushing the small charging tray out of the magazine clip prior to hooking and conveying the same to a material grasping position, grabbing a transferring device to put a chip in the small charging tray into a large charging tray, ejecting out the small empty charging tray prior to pushing the same into a collecting device for the small charging tray, and pushing the large charging tray full of materials into a blanking device of the large charging tray. The automatic IC charging-tray chip transferring machine comprises a small-charging-tray conveying module device, a large-charging-tray conveying device, a chip grabbing and transferring device, an electrical control system and a display system, the small-charging-tray conveying module device and the large-charging-tray conveying device are connected and are used for grabbing the chip in the small charging tray and putting the chip in the chip grabbing and transferring device in the large charging tray, and the electrical control system is electrically connected with the small-charging-tray conveying module device, the large-charging-tray conveying device and the chip grabbing and transferring device respectively. The automatic IC charging-tray chip transferring machine is high in automation degree, stable in operation performance, good in grabbing and transferring quality and high in production efficiency.

Description

technical field [0001] The invention relates to an IC chip moving device, in particular to an automatic IC chip transfer machine. Background technique [0002] At present, in the production and processing process of IC chips, many IC chips are transported by loading trays. When the production equipment used by the supplier and the buyer has different specifications for the trays, there are tray chips that need to be transferred. The problem. For example, if the supplier produces and supplies materials in small trays (304 grains per tray), and the buyer organizes follow-up production in large trays (490 grains per tray), for the buyer, there is a First, the chips in the small tray must be transferred to the large tray to adapt to the problem of equipment production in this enterprise. At present, many companies rely on manual methods to transfer chips from small trays to large trays. This method is not only inefficient (800-1000 grains / hour. person), labor-intensive, but al...

Claims

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Application Information

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IPC IPC(8): B65G1/00
Inventor 林宜龙陈薇刘飞唐召来胡家精黄善文杨友
Owner 深圳格芯集成电路装备有限公司
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