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Method for metalizing plated-through holes

A technology of metal spraying and plating through holes, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, electrical components, printed circuit manufacturing, etc., and can solve the problems that negative effects cannot be avoided sufficiently

Active Publication Date: 2015-04-08
CERAMTEC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Despite the inclusion of bonding glass in the paste, the negative effects of shrinkage are often not at least sufficiently avoided

Method used

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  • Method for metalizing plated-through holes

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Experimental program
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Effect test

Embodiment Construction

[0034] One for AIN or Al 2 o 3 Metallization paste for plated through-holes in ceramic substrates, manufactured according to the following recipe:

[0035] Oil Thixotrope 10% by weight

[0036] Oil Screen printing medium 10% by weight

[0037] Copper powder, d50 = 10 μm 1-90 %, preferably 50 % by weight

[0038] Copper powder, d50 = 1 μm 0-50 %, preferably 12 % by weight

[0039] Aluminum powder, d50 = 8 μm 0.1-10 %, preferably 5 % by weight

[0040] Bentonite, d50 = 12 μm 0.0-10 %, preferably 5 % by weight

[0041] Zinc oxide, d50 = 5 μm 0.1-5 %, preferably 2 % by weight

[0042] Quartz powder, d50 = 6 μm 0.1-5 %, preferably 1.5 % by weight

[0043] Boron oxide, d50 = 10 μm 0.1-5 %, preferably 1.5 % by weight

[0044] Copper(I) chloride, d50 = 5 μm 0.1-5 %, preferably 3 % by weight

[0045] The paste fixed weighed components were mixed in the tank with a spatula. The weighed oil is then added. HERAEUS 212 / thix, which is liquefied with HERAEUS 213 oil, can preferably ...

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Abstract

The invention relates to a method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.

Description

technical field [0001] The invention relates to a method for producing plated-through holes in circuit boards and to circuit boards produced in this way. Background technique [0002] Ceramic circuit boards must often be electrically contactable from both sides and make plated through-holes through the circuit board possible. This usually takes place via holes provided in the circuit board, which holes are filled with conductive metal. Such plated through holes or vias usually have a diameter of approximately 100 to 300 μm. [0003] Relatively expensive silver or other noble metal pastes consisting of one or more metal powders, possibly 1-10% by weight of a bonding glass component (e.g. PbO, B 2 o 3 、 Bi 2 o 3 or SiO 2 ), and high-boiling organic substances (including binders such as ethyl cellulose or vinyl butyral and solvents such as terpineol or ester alcohols). When the substrate material of the circuit board is composed of AlN, ZnO, SiO can be used 2 , CaO, Ti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/16
CPCH01B1/16C04B41/88C04B41/009C04B41/5127C04B2111/00844C04B35/00C04B35/10C04B35/581C04B14/12C04B41/4539C04B41/457C04B41/5006C04B41/5012C04B41/5035C04B41/5049C04B41/5155C04B37/02H05K3/42H05K1/115H05K3/0094
Inventor A. 蒂姆K. 赫尔曼
Owner CERAMTEC