Dicing sheet with protective film formation layer and method for producing chip
A protective film and layer-forming technology, applied in the manufacturing of pressure-sensitive films/sheets, film/sheet-like adhesives, semiconductor/solid-state devices, etc. , Excellent printing accuracy, easy peeling effect
Active Publication Date: 2015-04-22
LINTEC CORP
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[0160] Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples. In addition, in the following examples and comparative examples, , , and were measured and evaluated as follows. In addition, was prepared using the following , , and .
[0161]
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Abstract
[Problem] To provide a dicing sheet that is with a protective film formation layer, can easily produce a semiconductor chip having a protective film having high uniformity and superior printing precision, is such that the peeling of the protective film and the dicing sheet can be easily performed, and has superior affixing ability of chips during dicing. [Solution] The dicing sheet with a protective film formation layer is characterized by a protective film formation layer being peelably provided on the adhesive layer of an adhesive sheet resulting from the adhesive layer, which contains an adhesive component and a free epoxy group-containing compound, being laminated onto a substrate film.
Description
technical field [0001] The present invention relates to a dicing sheet with a protective film forming layer capable of forming a protective film on the back surface of a chip and improving chip manufacturing efficiency. Moreover, this invention relates to the manufacturing method of the chip|tip using the dicing sheet with a protective film formation layer. Background technique [0002] In recent years, in the manufacture of semiconductor devices, a mounting method called a so-called face down method is used. In the flip-chip method, a semiconductor chip (hereinafter also simply referred to as a "chip") having electrodes such as bumps on a circuit surface is used, and the electrodes are bonded to a substrate. Therefore, the surface of the chip opposite to the circuit surface (the back surface of the chip) is exposed. [0003] The exposed backside of the chip will be protected by an organic film. Conventionally, a chip having a protective film made of this organic film is ...
Claims
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IPC IPC(8): H01L21/301C09J4/00C09J7/02C09J163/00C09J7/22C09J7/38
CPCC09J7/0246C09J163/00C09J2203/326C09J2433/00C09J7/22C09J7/38H01L21/6836H01L23/544H01L2221/68336H01L2221/6834H01L2221/68327H01L2221/68377H01L2223/54433H01L2223/54486H01L2924/0002C09J7/401Y10T428/1471H01L21/78H01L2924/00
Inventor 佐伯尚哉筱田智则高野健
Owner LINTEC CORP