A semiconductor ignition bridge with composite self-heating reflective layer for energy gathering

A reflective layer and semiconductor technology, applied in offensive equipment, fuzes, etc., can solve problems such as low ignition energy, reduce heat loss, shorten high-temperature plasma time, and improve energy utilization.

Inactive Publication Date: 2017-11-21
ZHONGBEI UNIV
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a semiconductor ignition bridge with composite self-heating reflective layer energy gathering, which solves the problem of low ignition energy of the existing semiconductor ignition bridge, and can adapt to micro-fuzes, micro-satellites, micro-propellers and automobile airbag micro-ignition devices needs

Method used

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  • A semiconductor ignition bridge with composite self-heating reflective layer for energy gathering
  • A semiconductor ignition bridge with composite self-heating reflective layer for energy gathering
  • A semiconductor ignition bridge with composite self-heating reflective layer for energy gathering

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Embodiment Construction

[0019] Below in conjunction with accompanying drawing, the present invention is described in further detail:

[0020] A compound self-heating reflective layer energy-gathering semiconductor ignition bridge, such as figure 1 As shown, the ignition bridge body consists of a base layer 1, an insulating layer 2, a heat-absorbing energy-gathering reflective layer 3, a semiconductor bridge layer 4, a discrete solder layer 5 and a discrete electrode layer 6 (electrode 1, electrode 2) from bottom to bottom The above are stacked sequentially; the base layer 1, the insulating layer 2, and the heat-absorbing and energy-gathering reflective layer 3 are all rectangular in shape and the same size, and the semiconductor bridge layer 4 is narrow in the middle and wide at both ends, such as figure 2 and image 3 As shown, it can be a butterfly shape, an H shape, or a more complex shape. The discrete electrode layers 6 are separated from each other and cover the wide part at both ends of the ...

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Abstract

The invention provides a semiconductor ignition bridge with a composite self-heating reflective layer for energy gathering, which is formed by stacking a base layer, an insulating layer, a reflective layer, a semiconductor bridge layer, a discrete solder layer and a discrete electrode layer sequentially from bottom to top; rectangular Semiconductor silicon constitutes the base layer; silicon dioxide with the same size as the base layer forms an insulating layer, and the insulating layer covers the base layer; the reflective layer is made of monocrystalline silicon doped with concentrated boron (or phosphorus), and the size is the same as that of the base layer , deposited on the insulating layer; the semiconductor bridge layer is composed of concentrated boron (or phosphorus) implanted polysilicon, and the shape is wide at both ends and narrow in the middle; the two ends of the semiconductor bridge layer are coated with solder layers; then the electrode layer is directly bonded at high temperature on the solder layer. The invention has the functions of high electric energy utilization rate, large ignition output and good ignition promptness.

Description

technical field [0001] The invention belongs to the field of basic components of electrical explosive devices, and relates to a semiconductor ignition bridge, in particular to a semiconductor ignition bridge with a composite self-heating reflective layer for energy gathering. Background technique [0002] Electrical pyrotechnics is a device that converts electrical energy into the initial energy that triggers the combustion, explosion, and work of energetic materials. Nano-manufacturing and integrated integration is an unavoidable task in the field of modern equipment manufacturing and national defense technology to reduce weight, miniaturize, and make smart. MEMS ignition devices not only have the advantages of MEMS small size, large-scale manufacturing, low cost, and high functional integration, but also can greatly reduce the amount of sensitive ignition agents in pyrotechnics, thereby reducing the risk of manufacturing pyrotechnics and the impact on the environment. Pol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C06C5/00
Inventor 陈晓勇丑修建熊继军穆继亮安坤杨杰李惠琴许卓孙玉虹曹嘉峰
Owner ZHONGBEI UNIV
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