Flip chip unpackaged light source lens

A flip-chip and lens technology, which is applied in the field of flip-chip unpackaged light source lenses, can solve the problems that the advantages of flip-chip cannot be fully utilized, the height of the chip bump is small, and the structural size of the flip-chip unpackaged light source is small.

Inactive Publication Date: 2015-04-29
DONGGUAN NUOSI OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, due to the small structural size of the flip-chip unpackaged light source, the protrusion height of the chip protruding from the substrate is small,

Method used

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  • Flip chip unpackaged light source lens
  • Flip chip unpackaged light source lens
  • Flip chip unpackaged light source lens

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Embodiment Construction

[0020] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0021] Such as figure 1 with figure 2 As shown, a flip-chip unpackaged light source lens includes a lens body 100. The bottom of the lens body 100 is projected to be circular, and the center of the bottom is provided with a light entrance hole 110 that can accommodate an LED light source 200. The light entrance hole 110 is The wall is a light incident surface for light refraction, the bottom surface 120 of the lens body 100 is a light reflection surfa...

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Abstract

The invention discloses a flip chip unpackaged light source lens. The lens comprises a lens body, wherein the bottom projection is circular; a light entrance hole is formed in the center of the bottom; the bottom surface of the lens body is symmetrically provided with a plurality of downwardly protruding mounting columns; the part at the periphery of an opening of the light entrance hole sinks to form an inverted frustum-shaped sunken part; the sinking height of the sunken part does not exceed the length of the mounting columns; the surface of the sunken part and the bottom surface of the lens body are both provided with non-planar microscopic structures for light diffuse reflection; the mounting columns are fixedly glued on a base band, an LED (Light Emitting Diode) light source is accommodated in the light entrance hole, and the sunken part is covered at the periphery of the LED light source, so the lens can completely act on light emitted by the LED light source to improve the utilization rate of the light source; glue is prevented from introducing into the bottom surface of the lens body so as not to corrode the non-planar microscopic structure because of a gap existing between the mounting columns and the sunken part; the assembly reliability is high and the structure is concise.

Description

technical field [0001] The invention relates to the technical field of LED light source lenses, in particular to a flip-chip unpackaged light source lens. Background technique [0002] Light Emitting Diode (LED for short) has been widely used as a lighting source. Due to the special light-emitting principle of light-emitting diodes, the energy consumed by them is far lower than that of ordinary incandescent lamps at the same brightness, and they have the advantages of long life and no pollution, so they have attractive applications in the fields of lighting and backlighting. prospect. LED is a point light source. When it is used for lighting, a lens needs to be placed in front of the LED to reduce the divergence angle of the LED light, so that the light is concentrated near the optical axis and emitted. [0003] In order to avoid affecting the luminous efficiency due to the electrodes occupying the light-emitting area in the front-mounted chip, a flip-chip structure has em...

Claims

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Application Information

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IPC IPC(8): F21V5/04F21Y101/02
CPCF21V5/04
Inventor 颜坤
Owner DONGGUAN NUOSI OPTOELECTRONICS TECH
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