Apparatus and method for manufacturing electronic component

Abstract

The invention provides an apparatus and a method for manufacturing an electronic component. According to the apparatus and the method, a plurality of electronic parts are exactly contained at the inner part of a container by the cutting of cut objects. A packaging substrate provided with an integral substrate and semiconductor chips is cut to a plurality of area units to manufacture the plurality of electronic parts, the apparatus for manufacturing the electronic component comprises a rotation blade, a first conveying mechanism for fixing and moving the plurality of electronic parts, an output portion for outputting the plurality of electronic parts to the outside of the manufacturing apparatus, the container arranged below a moving path of the first conveying mechanism, and a scraping part fixed at the inner side of the container and is formed by a single plate-shaped part as a rigid part, wherein the integral substrate is provided with a plurality of areas, and the semiconductor chips are respectively arranged in the plurality of areas. By the movement of the first conveying mechanism, the scraping part and the electronic parts are contacted, the electronic parts are scraped, and the scraped electronic parts are contained in the container.

Description

technical field [0001] The present invention relates to an electronic component manufacturing apparatus and method for manufacturing a plurality of electronic components by cutting a cut object having at least a monolithic substrate and a functional portion, wherein the monolithic substrate has a plurality of regions, and The functional parts described above exist in the plurality of regions and function as electronic devices. Background technique [0002] When manufacturing electronic components, a technique of singulation into a plurality of electronic components by cutting a resin package using a rotating blade (blade) is widely practiced (for example, refer to Patent Document 1). [0003] refer to figure 1 , a first conventional example of a manufacturing apparatus of an electronic component will be described. figure 1 It is a plan view which shows the 1st conventional example of the manufacturing apparatus of an electronic component. In addition, for the convenience ...

AI Technical Summary

Problems solved by technology

First, due to the cutting water, there may be a situation where the electronic components 29 that are closely attached to the lower surface of the first conveying mechanism 8 do not fall.

Second, in the case where the first conveying mechanism 8 is formed of a rubber-based material (for example, refer to Patent Document 2) in order to facilitate the formation of the recess 25 and the suction path 26, since the electronic component 29 is easily adhered to the surface of the first conveying mechanism 8 The lower surface may produce the situation that the electronic component 29 does not fall from the lower surface of the first transport mechanism 8

However, this method increases the installation area (occupancy area) of the manufacturing apparatus M2 of the electronic component, so it is not preferable.

[0026] The second problem is as follows: the electronic component 29 is caught between the wires 35 of the brush, so that the electronic component 29 cannot be accommodated inside the storage box 33

However, this method reduces the operation rate of the electronic component manufacturing apparatus M2, so it is not preferable.

[0027] The third problem is as follows: When the wire 35 of the brush and the electronic part 29 are separated after being in contact, static electricity is generated, and this static electricity has a bad influence on the electronic part 29

Therefore, depending on the type of electronic component 29, the yield of electronic component 29 may decrease due to static electricity.

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