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Adhesive tape sticking device

A sticking device and adhesive tape technology, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems that the area of ​​the adhesive tape becomes larger and cannot fully suppress wrinkles, and achieve the effect of suppressing the generation of wrinkles

Active Publication Date: 2019-03-15
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in recent years, as the size of the wafer increases, the area of ​​the adhesive tape has also increased, and even with the above-mentioned adhesive tape application device that applies tension in a direction parallel to the delivery direction, wrinkles during application cannot be sufficiently suppressed. which produces such a problem

Method used

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  • Adhesive tape sticking device
  • Adhesive tape sticking device
  • Adhesive tape sticking device

Examples

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Embodiment Construction

[0106] Hereinafter, embodiments of the present invention will be described with reference to the drawings. figure 1 It is a perspective view schematically showing the structure of the adhesive tape application apparatus of this embodiment, figure 2 It is a partially cutaway side view schematically showing the structure of the adhesive tape sticking device.

[0107] image 3 is a diagram schematically showing the structure of an adhesive tape sticking device, Figure 4 It is a perspective view schematically showing the structure of the wafer etc. which stick the adhesive tape in the adhesive tape sticking apparatus. Additionally, in the Figure 1 to Figure 3 In each figure, a part of the structure of the adhesive tape sticking device is omitted.

[0108] Such as Figure 1 to Figure 3 As shown, the adhesive tape sticking apparatus 2 of this embodiment is equipped with the base 4 which supports each structure. A delivery roller (tape delivery unit) 6 is arranged above the ...

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Abstract

The invention provides a pasting device of splicing tapes. The pasting device is capable of restraining generation of wrinkles during pasting, being irrelevant to size of used splicing tapes. The pasting device (2) pastes a splicing tape (11) on a chip and an annular framework (33), and comprises a first tension imposing component and a second tension imposing component. The first tension imposing component is formed by multiple rollers and is used for positioning the splicing tape to be parallel to a keeping face of a clamp disc working bench (22) and imposing tension (F1) in the conveying direction (D1) of the splicing tape on the splicing tape. The second tension imposing component comprises a pair of splicing tape clamping parts (44a, 44b) clamping edge parts (11a, 11b) of the splicing tape and is used for imposing tension (F2) on the splicing tape which is imposed with tension by the first tension imposing component in the direction which is orthogonal to the conveying direction of the splicing tape and parallel to the keeping face of the clamp disc working bench.

Description

technical field [0001] The present invention relates to an adhesive tape applying device for applying an adhesive tape to a wafer before dicing and a frame surrounding the wafer. Background technique [0002] A disc-shaped wafer on which devices such as ICs are formed on the front surface is cut, for example, by a cutting device equipped with a rotatable circular cutting tool, or a laser processing device equipped with a processing head for laser irradiation, thereby being divided into parts and components. Corresponding multiple chips. [0003] When dicing a wafer, an adhesive tape is attached to the back surface of the wafer in advance, and a ring-shaped frame surrounding the wafer is fixed to the outer peripheral portion of the adhesive tape. Thereby, it is possible to prevent dispersion of the diced chips and maintain workability. [0004] In order to stick the wafer and the frame to the adhesive tape, for example, a tape body in which a circular adhesive tape having a...

Claims

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Application Information

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IPC IPC(8): H01L21/683
CPCH01L21/6836H01L2221/68354
Inventor 大西淳裕
Owner DISCO CORP
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