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Vibrator, oscillator, electronic device, and moving object

A technology for electronic equipment and moving objects, applied in electrical components, impedance networks, etc., to solve problems such as small mass, inability to obtain vibration characteristics, and inability to attenuate bending vibrations.

Inactive Publication Date: 2015-04-29
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the MEMS vibrator described in Patent Document 1, although there is one support portion, which is advantageous for miniaturization, there is a problem that the mass of the support portion that fixes the cantilever beam vibrating in the thickness direction of the substrate is small. , so the bending vibration of the beam of the movable second electrode cannot be attenuated, and the vibration of the beam will leak to the entire substrate along the supporting part, and a high Q value cannot be obtained, so that stable vibration characteristics and desired vibration characteristics cannot be obtained

Method used

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  • Vibrator, oscillator, electronic device, and moving object
  • Vibrator, oscillator, electronic device, and moving object
  • Vibrator, oscillator, electronic device, and moving object

Examples

Experimental program
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Effect test

Embodiment approach

[0053] [vibrator]

[0054] First, the MEMS vibrator 100 as the vibrator of the present embodiment will be described.

[0055] figure 1 (a) is a top view of the MEMS vibrator 100, figure 1 (b) is along figure 1 A sectional view of line A-A in (a), figure 1 (c) is along figure 1 (a) Cross-sectional view along line BB.

[0056] The MEMS vibrator 100 is an electrostatic beam-type vibrator including a fixed electrode (lower electrode 10 ) formed on a substrate 1 and a movable electrode (upper electrode 20 ) formed away from the substrate 1 and the fixed electrode. By etching the sacrificial layer laminated on the main surface of the substrate 1 and the fixed electrodes, the movable electrodes are formed away from the slave substrate 1 and the fixed electrodes.

[0057] In addition, the sacrificial layer is a layer temporarily formed by an oxide film or the like, and is removed by etching after forming necessary layers on the upper, lower, and peripheral sides thereof. By rem...

Deformed example 1

[0079] image 3 (a)~(d) and Figure 4 (e) to (h) are plan views showing examples of variations of the support portion provided on the upper electrode of the vibrator (MEMS vibrator 100 ) according to Modification 1. FIG.

[0080] In this embodiment, if figure 1 As shown in (a), although the shape of the support part 26 is comprised in rectangle, it is not limited to this structure. Moreover, although one support part 26 is provided, it is not limited to this, You may provide several support parts 26. FIG.

[0081] image 3 (a) shows an example of the shape of the polygonal support part 26a. Since the support portion 26a is polygonal and has more corners than a rectangle, stress due to vibration can be suppressed from concentrating on the corners, and thus the MEMS vibrator 100 having stable vibration characteristics can be obtained.

[0082] image 3 (b) shows an example of the shape of the support part 26b which has a curved part. Since the support portion 26a has a cu...

Deformed example 2

[0090] Figure 5 (a) to (d) are plan views showing examples of changes in the upper electrode of the vibrator (MEMS vibrator 100 ) according to the second modification.

[0091] In this embodiment, if figure 1 As shown in (a), the case where the upper electrode 20 is formed in a cross shape by the four vibrating parts 24 extending from the base part 22 has been described, but the configuration is not limited to this. The number of vibrating parts 24 may be even or odd, as long as the upper electrode 20 is formed to be four or more.

[0092] Figure 5 (a) shows an example of the upper electrode 20 a configured in a disk shape. When vibrating portions 24a adjacent to each other vibrate so that the vibration phases are opposite, it is possible to provide MEMS vibrator 100 with a high Q value in which reduction in vibration efficiency is suppressed and vibration leakage is suppressed.

[0093] Figure 5 (b) shows an example of the upper electrode 20b having six vibrating part...

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PUM

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Abstract

A MEMS vibrator includes: a substrate; a supporting portion which is connected to the substrate; a base portion which is connected to the supporting portion; and a plurality of vibration portions which is separated from the substrate and extends in different directions from each other from the base portion, and in which the adjacent vibration portions vibrate in a phase of a reverse direction to each other. In the vibration portion, the base portion has a vibration node, and at least a part of the supporting portion is overlapped with the vibration node in a planar view.

Description

technical field [0001] The present invention relates to a vibrator, an oscillator including the vibrator, electronic equipment, and a mobile body. Background technique [0002] In general, electromechanical system structures (for example, vibrators, filters, sensors, motors, etc.) are known, which have the capability of being called MEMS (Micro Electro Mechanical System, microelectromechanical system) devices formed by semiconductor microfabrication technology. A structure that moves mechanically. Among them, MEMS oscillators are easier to manufacture by being integrated into semiconductor circuits than conventional oscillators and resonators using quartz or dielectrics, and are advantageous for miniaturization and high functionality, so they have a wide range of applications. [0003] As typical examples of conventional MEMS vibrators, there are known a comb-type vibrator vibrating in a direction parallel to a substrate surface on which the vibrator is provided, and a beam...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/02H03H9/19
CPCH03H3/0072H03H9/2436H03H2009/02385
Inventor 山田明法
Owner SEIKO EPSON CORP