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A kind of production method of FR4 reinforcing board and the reinforcing method of FPC

A production method and reinforcement board technology, applied in printed circuit parts, electrical components, printed circuit manufacturing, etc., can solve the problems of increasing FPC processing links and increasing production costs, so as to facilitate product thickness, improve bonding force, and save The effect of the machining process

Active Publication Date: 2017-11-03
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These practices increase the FPC processing link, leading to an increase in production costs

Method used

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  • A kind of production method of FR4 reinforcing board and the reinforcing method of FPC
  • A kind of production method of FR4 reinforcing board and the reinforcing method of FPC
  • A kind of production method of FR4 reinforcing board and the reinforcing method of FPC

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] In this example, a production method of FR4 reinforcing plate with a thickness specification of 0.4mm is introduced, and two prepregs 2 of model 7628 are provided, and the initial reaction temperature of the prepreg 2 is determined to be 130°C and the peak reaction temperature is determined by DSC detection. The temperature is 165°C, and the maximum hot-pressing temperature is determined to be 150°C by the initial reaction temperature and the peak reaction temperature; the two prepregs 2 are stacked to form a prepreg assembly; after setting release films on both surfaces of the prepreg assembly, The prepreg assembly was hot-pressed at a maximum hot-pressing temperature of 150° C. for 30 minutes to form an FR4 reinforcement board 1 . The ΔTg of the FR4 reinforced plate 1 detected by DSC was 15°C.

[0054] After it is directly combined with FPC by hot pressing, the vertical peel strength is tested to be 1.0N / mm.

[0055] Use the FR4 reinforcement board 1 to laminate with...

Embodiment 2

[0057] In this example, another production method of FR4 reinforcing plate with a thickness specification of 0.4mm is introduced, and two prepregs 2 of model 7628 are provided, and the initial reaction temperature of the prepreg 2 is determined to be 130°C and the peak value is determined by DSC detection. The reaction temperature is 165°C, and the maximum hot pressing temperature is determined to be 140°C based on the initial reaction temperature and the peak reaction temperature; the two prepregs 2 are stacked to form a prepreg assembly; , hot-press the prepreg assembly at a maximum hot-pressing temperature of 140° C. for 30 minutes to form an FR4 reinforcement board 1 . The ΔTg of the FR4 reinforced plate 1 detected by DSC was 20°C.

[0058] After it is directly combined with FPC by hot pressing, the vertical peel strength is 1.8N / mm.

[0059] Use the FR4 reinforcement board 1 to laminate with 1 oz electrolytic copper foil and 25 μm thermosetting adhesive film, hot press a...

Embodiment 3

[0061] In this example, another production method of FR4 reinforcing plate with a thickness specification of 0.4mm is introduced, and two prepregs 2 of model 7628 are provided, and the initial reaction temperature of the prepreg 2 is determined to be 130°C and the peak value is determined by DSC detection. The reaction temperature is 165°C, and the maximum hot pressing temperature is determined to be 160°C by the initial reaction temperature and the peak reaction temperature; the two prepregs 2 are stacked to form a prepreg assembly; , hot-press the prepreg assembly at a maximum hot-pressing temperature of 160° C. for 30 minutes to form an FR4 reinforcement board 1 . The ΔTg of the FR4 reinforced plate 1 detected by DSC was 10°C.

[0062] After it is directly combined with FPC by hot pressing, the vertical peel strength is tested to be 0.8N / mm.

[0063] Use the FR4 reinforcing plate to laminate with 1 oz electrolytic copper foil and 25μm thermosetting adhesive film, hot press...

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Abstract

The invention discloses a production method of FR4 reinforcing plate, provides a prepreg, determines the initial reaction temperature and the peak reaction temperature of the prepreg, and makes the highest hot pressing temperature between the initial reaction temperature and the peak reaction temperature of the prepreg; A number of prepregs are stacked to form a prepreg assembly; the prepreg assembly is hot-pressed at the highest hot-pressing temperature to form an FR4 reinforcement board. The invention provides a production method of FR4 reinforcing plate with self-adhesiveness. The FR4 reinforcing plate produced by the method can be directly used for FPC reinforcement, saves the processing flow, and is convenient to control the thickness of the product; it can also be used with The thermosetting adhesive film is used to reinforce the FPC to improve its bonding force with the thermosetting adhesive film. In addition, the invention also discloses the FR4 reinforcing plate produced by the above method and the method for reinforcing the FPC with the above FR4 reinforcing plate.

Description

technical field [0001] The invention relates to the technical field of FPC production, in particular to a production method of an FR4 reinforcing board and a reinforcing method of an FPC. Background technique [0002] Stiffeners, also called Stiffeners, are widely used in FPC flexible circuit boards in electronic products. Stiffeners mainly solve the flexibility of flexible circuit boards, improve the strength of the plug-in parts, and facilitate the overall assembly of products. [0003] The general bonding method of the existing FPC and FR4 reinforced board (glass fiber reinforced board) is to first attach a layer of thermosetting adhesive film on the surface of the FR4 reinforced board, then drill positioning holes and punch out the shape, and finally Hot pressing after bonding with FPC. [0004] This approach not only increases the processing flow of FPC, increases the production cost, but also is not conducive to the control of the thickness of FPC finished products. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/00
Inventor 路伟征
Owner GUANGDONG SHENGYI SCI TECH