A kind of production method of FR4 reinforcing board and the reinforcing method of FPC
A production method and reinforcement board technology, applied in printed circuit parts, electrical components, printed circuit manufacturing, etc., can solve the problems of increasing FPC processing links and increasing production costs, so as to facilitate product thickness, improve bonding force, and save The effect of the machining process
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Embodiment 1
[0053] In this example, a production method of FR4 reinforcing plate with a thickness specification of 0.4mm is introduced, and two prepregs 2 of model 7628 are provided, and the initial reaction temperature of the prepreg 2 is determined to be 130°C and the peak reaction temperature is determined by DSC detection. The temperature is 165°C, and the maximum hot-pressing temperature is determined to be 150°C by the initial reaction temperature and the peak reaction temperature; the two prepregs 2 are stacked to form a prepreg assembly; after setting release films on both surfaces of the prepreg assembly, The prepreg assembly was hot-pressed at a maximum hot-pressing temperature of 150° C. for 30 minutes to form an FR4 reinforcement board 1 . The ΔTg of the FR4 reinforced plate 1 detected by DSC was 15°C.
[0054] After it is directly combined with FPC by hot pressing, the vertical peel strength is tested to be 1.0N / mm.
[0055] Use the FR4 reinforcement board 1 to laminate with...
Embodiment 2
[0057] In this example, another production method of FR4 reinforcing plate with a thickness specification of 0.4mm is introduced, and two prepregs 2 of model 7628 are provided, and the initial reaction temperature of the prepreg 2 is determined to be 130°C and the peak value is determined by DSC detection. The reaction temperature is 165°C, and the maximum hot pressing temperature is determined to be 140°C based on the initial reaction temperature and the peak reaction temperature; the two prepregs 2 are stacked to form a prepreg assembly; , hot-press the prepreg assembly at a maximum hot-pressing temperature of 140° C. for 30 minutes to form an FR4 reinforcement board 1 . The ΔTg of the FR4 reinforced plate 1 detected by DSC was 20°C.
[0058] After it is directly combined with FPC by hot pressing, the vertical peel strength is 1.8N / mm.
[0059] Use the FR4 reinforcement board 1 to laminate with 1 oz electrolytic copper foil and 25 μm thermosetting adhesive film, hot press a...
Embodiment 3
[0061] In this example, another production method of FR4 reinforcing plate with a thickness specification of 0.4mm is introduced, and two prepregs 2 of model 7628 are provided, and the initial reaction temperature of the prepreg 2 is determined to be 130°C and the peak value is determined by DSC detection. The reaction temperature is 165°C, and the maximum hot pressing temperature is determined to be 160°C by the initial reaction temperature and the peak reaction temperature; the two prepregs 2 are stacked to form a prepreg assembly; , hot-press the prepreg assembly at a maximum hot-pressing temperature of 160° C. for 30 minutes to form an FR4 reinforcement board 1 . The ΔTg of the FR4 reinforced plate 1 detected by DSC was 10°C.
[0062] After it is directly combined with FPC by hot pressing, the vertical peel strength is tested to be 0.8N / mm.
[0063] Use the FR4 reinforcing plate to laminate with 1 oz electrolytic copper foil and 25μm thermosetting adhesive film, hot press...
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