Manufacturing method of burn-in semiconductor test board

Abstract

The invention relates to a manufacturing method for a Burn-in semiconductor test board. The manufacturing method includes the procedure of adopting a transparent micro-adhesion film for protecting the BGA region of an ultra-high board size, the thickness method of a lamination structure of a gold finger region, the procedure of manufacturing a technology edge through combination of flow stopping blocks and flow stopping points and the mode of independently measuring expanding and shrinking of each BGA unit of a BGA and drilling of each BGA unit of the BGA through positioning. The problems that the Burn-in semiconductor test board is high in requirement for aligning of the BGA, has the requirement for the thickness of the gold finger board and is prone to wrinkling are solved, and the manufacturing methods of difficult points are optimized so that a higher product yield can be achieved.

Description

technical field [0001] The invention relates to the field of manufacturing semiconductor test boards, in particular to a method for manufacturing a burn-in semiconductor test board. Background technique [0002] As a high value-added PCB board, semiconductor test boards are used to test semiconductor wafers to screen out qualified products. Generally, they can be divided into ATE test boards, probe-card test boards and burn-in test boards. refer to figure 1 , where the burn-in semiconductor test board has an array BGA (4*4 or 5*4) with super long size (long side > 20inch), golden finger, small pitch (0.4mm or 0.5mm, requiring wiring in BGA) ) and the BGA needs to be installed with a socket. At present, the appearance requirements for the scratches of the pad base material of the BGA and the defect of the pad are becoming more and more strict, so the manufacturing of the semiconductor test board is more difficult than the production of ordinary PCB boards. In the existing t...

AI Technical Summary

Problems solved by technology

In the existing technology, due to the characteristics of the Burn-in semiconductor test board, the difficulties in its production are mainly reflected in the following: First, the problem of the size of the ultra-long board: in the transfer process after the outer graphics process, scratches are prone to occur Or the problem of the graphic on the scratched board surface, and there is no protective measure for the graphic on the board surface in the post-processing process

Second, the problems in the gold finger area: the inner layer design of the gold finger area of ​​the burn-in semiconductor test board is generally the base material, and the existing method for designing the thickness of the laminated structure is: lamination design plate thickness range = complete Board thickness range - thickness range of outer copper plating layer - thickness range of solder mask layer, this laminated structure can easily lead to substandard board thickness in the gold finger area, thicker or thinner, and the common process edge, that is, flow block or Choke point, see figure 2 and image 3 , during the lamination process, it is easy to cause the problem of copper foil wrinkling in the gold finger area after lamination

Third, the alignment problem of the array BGA: each BGA unit has a pitch of 0.4mm, and the wiring in the BGA is currently commonly used in the 3-hole or 4-hole positioning drilling method, which is difficult to guarantee 0.4mm For the alignment requirements of the pitch, use the target holes on the edge of the board to measure the expansion and contraction in the X and Y directions, and use it to stretch the drill tapes of all BGAs on the entire board for drilling, and it is impossible to guarantee the alignment of all BGA holes. bit effects

refer to Figure 4 , in the actual production process, due to the bonding of the semi-cured edge of the inner layer of the PCB board, the inner layer graphics of the board will expand and shrink after pressing, and the traditional method of stretching the drill tape is to measure the edge of the board The distance between the 4 targets 30' to calculate the overall expansion and contraction value, that is, 2 in the long direction and 2 in the short direction to measure the overall expansion and contraction value, which is used to stretch the overall drilling belt. This kind of expansion and contraction measurement is not conducive to Small pitch BGA drilling alignment

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